AMD 3015Ce vs Intel Core i7-2655LE
Comparative analysis of AMD 3015Ce and Intel Core i7-2655LE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD 3015Ce
- Around 5% higher maximum core temperature: 105 °C vs 100 C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
- 4.2x lower typical power consumption: 6 Watt vs 25 Watt
- Around 9% better performance in PassMark - Single thread mark: 1341 vs 1231
- Around 5% better performance in PassMark - CPU mark: 2094 vs 1999
Specifications (specs) | |
Maximum core temperature | 105 °C vs 100 C |
Manufacturing process technology | 14 nm vs 32 nm |
Thermal Design Power (TDP) | 6 Watt vs 25 Watt |
Benchmarks | |
PassMark - Single thread mark | 1341 vs 1231 |
PassMark - CPU mark | 2094 vs 1999 |
Reasons to consider the Intel Core i7-2655LE
- Around 26% higher clock speed: 2.90 GHz vs 2.3 GHz
Maximum frequency | 2.90 GHz vs 2.3 GHz |
Compare benchmarks
CPU 1: AMD 3015Ce
CPU 2: Intel Core i7-2655LE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD 3015Ce | Intel Core i7-2655LE |
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PassMark - Single thread mark | 1341 | 1231 |
PassMark - CPU mark | 2094 | 1999 |
Compare specifications (specs)
AMD 3015Ce | Intel Core i7-2655LE | |
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Essentials |
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Architecture codename | Zen | Sandy Bridge |
Launch date | 29 Apr 2021 | Q1'11 |
OPN Tray | AM301CBRP2OFJ | |
Place in performance rating | 1788 | 1901 |
Vertical segment | Laptop | Embedded |
Processor Number | i7-2655LE | |
Series | Legacy Intel® Core™ Processors | |
Status | Launched | |
Performance |
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Base frequency | 1.2 GHz | 2.20 GHz |
L1 cache | 192 KB | |
L2 cache | 1 MB | |
L3 cache | 4 MB | |
Manufacturing process technology | 14 nm | 32 nm |
Maximum core temperature | 105 °C | 100 C |
Maximum frequency | 2.3 GHz | 2.90 GHz |
Number of cores | 2 | 2 |
Number of GPU cores | 3 | |
Number of threads | 4 | 4 |
Unlocked | ||
64 bit support | ||
Bus Speed | 5 GT/s DMI | |
Memory |
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Max memory channels | 1 | 2 |
Supported memory types | DDR4-1600 | DDR3 1066/1333 |
Maximum memory size | 16.6 GB | |
Graphics |
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Graphics base frequency | 600 MHz | 650 MHz |
Number of pipelines | 192 | |
Processor graphics | Radeon Vega 3 | Intel® HD Graphics 3000 |
Graphics max dynamic frequency | 1.00 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Graphics interfaces |
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DisplayPort | ||
HDMI | ||
CRT | ||
eDP | ||
Number of displays supported | 2 | |
SDVO | ||
Compatibility |
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Sockets supported | FT5 | FCBGA1023 |
Thermal Design Power (TDP) | 6 Watt | 25 Watt |
Low Halogen Options Available | ||
Package Size | 31mm x 24mm (FCBGA1023) | |
Peripherals |
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PCI Express revision | 3.0 | 2.0 |
Max number of PCIe lanes | 16 | |
PCIe configurations | 1x16, 2x8, 1x8+2x4 | |
Security & Reliability |
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Intel® Identity Protection technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |