AMD Opteron 6308 vs AMD Opteron 2350 HE

Comparative analysis of AMD Opteron 6308 and AMD Opteron 2350 HE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility. Benchmark processor performance analysis: CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), PassMark - Single thread mark, PassMark - CPU mark.

AMD Opteron 6308

AMD Opteron 2350 HE

Differences

Reasons to consider the AMD Opteron 6308

A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
2x more L2 cache, more data can be stored in the L2 cache for quick access later
8x more L3 cache, more data can be stored in the L3 cache for quick access later

Manufacturing process technology	32 nm vs 65 nm
L2 cache	4 MB vs 2048 KB (shared)
L3 cache	16 MB vs 2048 KB

Reasons to consider the AMD Opteron 2350 HE

Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
Around 46% lower typical power consumption: 79 Watt vs 115 Watt

L1 cache	256 KB (shared) vs 192 KB
Thermal Design Power (TDP)	79 Watt vs 115 Watt

Compare benchmarks

CPU 1: AMD Opteron 6308
CPU 2: AMD Opteron 2350 HE

Name	AMD Opteron 6308	AMD Opteron 2350 HE
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	8.902
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)	20.184
CompuBench 1.5 Desktop - T-Rex (Frames/s)	0.41
CompuBench 1.5 Desktop - Video Composition (Frames/s)	1.163
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)	4.802
PassMark - Single thread mark		0
PassMark - CPU mark		2820

Compare specifications (specs)

	AMD Opteron 6308	AMD Opteron 2350 HE
Essentials
Family	AMD Opteron
OPN Tray	OS6308WKT4GHK
Place in performance rating	2942	3235
Series	AMD Opteron 6300 Series Processor
Vertical segment	Server	Server
Architecture codename		Barcelona
Launch date		October 2008
Performance
Base frequency	3.5 GHz
L1 cache	192 KB	256 KB (shared)
L2 cache	4 MB	2048 KB (shared)
L3 cache	16 MB	2048 KB
Manufacturing process technology	32 nm	65 nm
Maximum core temperature	74.40°C
Number of cores	4	4
Number of threads	4
Unlocked
64 bit support
Die size		285 mm
Maximum case temperature (TCase)		76 °C
Maximum frequency		2 GHz
Transistor count		463 million
Memory
Supported memory frequency	2000 MHz
Supported memory types	DDR3
Compatibility
Sockets supported	G34	Fr2
Thermal Design Power (TDP)	115 Watt	79 Watt