AMD Phenom II X3 720 vs Intel Core i5-650
Comparative analysis of AMD Phenom II X3 720 and Intel Core i5-650 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Graphics, Graphics interfaces, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the AMD Phenom II X3 720
- 1 more cores, run more applications at once: 3 vs 2
- 3x more L1 cache, more data can be stored in the L1 cache for quick access later
- 3x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
| Number of cores | 3 vs 2 |
| L1 cache | 128 KB (per core) vs 64 KB (per core) |
| L2 cache | 512 KB (per core) vs 256 KB (per core) |
| L3 cache | 6144 KB (shared) vs 4096 KB (shared) |
Reasons to consider the Intel Core i5-650
- Around 24% higher clock speed: 3.46 GHz vs 2.8 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- Around 30% lower typical power consumption: 73 Watt vs 95 Watt
- Around 23% better performance in PassMark - Single thread mark: 1363 vs 1108
- Around 41% better performance in PassMark - CPU mark: 2255 vs 1600
- Around 39% better performance in Geekbench 4 - Single Core: 520 vs 374
- Around 19% better performance in Geekbench 4 - Multi-Core: 1152 vs 968
| Specifications (specs) | |
| Maximum frequency | 3.46 GHz vs 2.8 GHz |
| Manufacturing process technology | 32 nm vs 45 nm |
| Thermal Design Power (TDP) | 73 Watt vs 95 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 1363 vs 1108 |
| PassMark - CPU mark | 2255 vs 1600 |
| Geekbench 4 - Single Core | 520 vs 374 |
| Geekbench 4 - Multi-Core | 1152 vs 968 |
Compare benchmarks
CPU 1: AMD Phenom II X3 720
CPU 2: Intel Core i5-650
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| Name | AMD Phenom II X3 720 | Intel Core i5-650 |
|---|---|---|
| PassMark - Single thread mark | 1108 | 1363 |
| PassMark - CPU mark | 1600 | 2255 |
| Geekbench 4 - Single Core | 374 | 520 |
| Geekbench 4 - Multi-Core | 968 | 1152 |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 5.924 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 29.917 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 2.394 |
Compare specifications (specs)
| AMD Phenom II X3 720 | Intel Core i5-650 | |
|---|---|---|
Essentials |
||
| Architecture codename | Heka | Clarkdale |
| Launch date | January 2010 | January 2010 |
| Launch price (MSRP) | $75 | $35 |
| Place in performance rating | 2580 | 2691 |
| Price now | $69.99 | $99.99 |
| Value for money (0-100) | 11.28 | 9.14 |
| Vertical segment | Desktop | Desktop |
| Processor Number | i5-650 | |
| Series | Legacy Intel® Core™ Processors | |
| Status | Discontinued | |
Performance |
||
| 64 bit support | ||
| Die size | 258 mm | 81 mm2 |
| L1 cache | 128 KB (per core) | 64 KB (per core) |
| L2 cache | 512 KB (per core) | 256 KB (per core) |
| L3 cache | 6144 KB (shared) | 4096 KB (shared) |
| Manufacturing process technology | 45 nm | 32 nm |
| Maximum frequency | 2.8 GHz | 3.46 GHz |
| Number of cores | 3 | 2 |
| Transistor count | 758 million | 382 million |
| Base frequency | 3.20 GHz | |
| Bus Speed | 2.5 GT/s DMI | |
| Maximum core temperature | 72.6°C | |
| Number of threads | 4 | |
| VID voltage range | 0.6500V-1.4000V | |
Memory |
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| Supported memory types | DDR3 | DDR3 1066/1333 |
| Max memory channels | 2 | |
| Maximum memory bandwidth | 21 GB/s | |
| Maximum memory size | 16.38 GB | |
Compatibility |
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| Max number of CPUs in a configuration | 1 | 1 |
| Sockets supported | AM3 | FCLGA1156 |
| Thermal Design Power (TDP) | 95 Watt | 73 Watt |
| Low Halogen Options Available | ||
| Package Size | 37.5mm x 37.5mm | |
Graphics |
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| Graphics base frequency | 733 MHz | |
| Intel® Clear Video HD technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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| Number of displays supported | 2 | |
Peripherals |
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| Max number of PCIe lanes | 16 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16, 2x8 | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Flexible Display interface (FDI) | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.2 | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Physical Address Extensions (PAE) | 36-bit | |
| Thermal Monitoring | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
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