AMD Ryzen 3 Pro 2100GE vs Intel Core i9-9900KF
Comparative analysis of AMD Ryzen 3 Pro 2100GE and Intel Core i9-9900KF processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the AMD Ryzen 3 Pro 2100GE
- 2.7x lower typical power consumption: 35 Watt vs 95 Watt
Thermal Design Power (TDP) | 35 Watt vs 95 Watt |
Reasons to consider the Intel Core i9-9900KF
- 4 more cores, run more applications at once: 8 vs 4
- 12 more threads: 16 vs 4
- Around 62% better performance in PassMark - Single thread mark: 2933 vs 1809
- 4.5x better performance in PassMark - CPU mark: 18318 vs 4062
Specifications (specs) | |
Number of cores | 8 vs 4 |
Number of threads | 16 vs 4 |
Benchmarks | |
PassMark - Single thread mark | 2933 vs 1809 |
PassMark - CPU mark | 18318 vs 4062 |
Compare benchmarks
CPU 1: AMD Ryzen 3 Pro 2100GE
CPU 2: Intel Core i9-9900KF
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen 3 Pro 2100GE | Intel Core i9-9900KF |
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PassMark - Single thread mark | 1809 | 2933 |
PassMark - CPU mark | 4062 | 18318 |
Geekbench 4 - Single Core | 1343 | |
Geekbench 4 - Multi-Core | 8735 | |
3DMark Fire Strike - Physics Score | 7066 |
Compare specifications (specs)
AMD Ryzen 3 Pro 2100GE | Intel Core i9-9900KF | |
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Essentials |
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Launch date | Q2'19 | Q1'19 |
Place in performance rating | 1322 | 882 |
Vertical segment | Desktop | Desktop |
Architecture codename | Coffee Lake | |
Processor Number | i9-9900KF | |
Series | 9th Generation Intel® Core™ i9 Processors | |
Status | Launched | |
Performance |
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64 bit support | ||
Base frequency | 3.2 GHz | 3.60 GHz |
L2 cache | 2 MB | |
L3 cache | 4 MB | |
Number of cores | 4 | 8 |
Number of threads | 4 | 16 |
Bus Speed | 8 GT/s DMI3 | |
Manufacturing process technology | 14 nm | |
Maximum core temperature | 100°C | |
Maximum frequency | 5.00 GHz | |
Memory |
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Max memory channels | 2 | 2 |
Supported memory types | DDR4-2933 | DDR4-2666 |
Maximum memory bandwidth | 41.6 GB/s | |
Maximum memory size | 128 GB | |
Compatibility |
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Sockets supported | AM4 | FCLGA1151 |
Thermal Design Power (TDP) | 35 Watt | 95 Watt |
Max number of CPUs in a configuration | 1 | |
Package Size | 37.5mm x 37.5mm | |
Thermal Solution | PCG 2015D (130W) | |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 3.0 | |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |