AMD Ryzen Embedded V2718 vs Intel Core i3-10100E

Comparative analysis of AMD Ryzen Embedded V2718 and Intel Core i3-10100E processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Compatibility, Peripherals, Graphics API support, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the AMD Ryzen Embedded V2718

  • CPU is newer: launch date 6 month(s) later
  • 4 more cores, run more applications at once: 8 vs 4
  • 8 more threads: 16 vs 8
  • Around 9% higher clock speed: 4.15 GHz vs 3.80 GHz
  • Around 5% higher maximum core temperature: 105 °C vs 100°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
  • 4x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 33% more L3 cache; more data can be stored in the L3 cache for quick access later
  • 4.3x lower typical power consumption: 15 Watt vs 65 Watt
  • Around 92% better performance in PassMark - CPU mark: 16075 vs 8365
Specifications (specs)
Launch date 10 Nov 2020 vs 30 Apr 2020
Number of cores 8 vs 4
Number of threads 16 vs 8
Maximum frequency 4.15 GHz vs 3.80 GHz
Maximum core temperature 105 °C vs 100°C
Manufacturing process technology 7 nm vs 14 nm
L2 cache 4 MB vs 1 MB
L3 cache 8 MB vs 6 MB
Thermal Design Power (TDP) 15 Watt vs 65 Watt
Benchmarks
PassMark - CPU mark 16075 vs 8365

Reasons to consider the Intel Core i3-10100E

  • 2x more maximum memory size: 128 GB vs 64 GB
  • Around 4% better performance in PassMark - Single thread mark: 2333 vs 2240
Specifications (specs)
Maximum memory size 128 GB vs 64 GB
Benchmarks
PassMark - Single thread mark 2333 vs 2240

Compare benchmarks

CPU 1: AMD Ryzen Embedded V2718
CPU 2: Intel Core i3-10100E

PassMark - Single thread mark
CPU 1
CPU 2
2240
2333
PassMark - CPU mark
CPU 1
CPU 2
16075
8365
Name AMD Ryzen Embedded V2718 Intel Core i3-10100E
PassMark - Single thread mark 2240 2333
PassMark - CPU mark 16075 8365
GFXBench 4.0 - Car Chase Offscreen (Frames) 1952
GFXBench 4.0 - Car Chase Offscreen (Fps) 1952
GFXBench 4.0 - Manhattan (Frames) 4738
GFXBench 4.0 - Manhattan (Fps) 4738
GFXBench 4.0 - T-Rex (Frames) 8006
GFXBench 4.0 - T-Rex (Fps) 8006

Compare specifications (specs)

AMD Ryzen Embedded V2718 Intel Core i3-10100E

Essentials

Architecture codename Zen 2 Comet Lake
Launch date 10 Nov 2020 30 Apr 2020
OPN Tray 100-000000242
Place in performance rating 870 276
Launch price (MSRP) $125
Processor Number i3-10100E
Series 10th Generation Intel Core i3 Processors
Status Launched
Vertical segment Embedded

Performance

Base frequency 1.7 GHz 3.20 GHz
L1 cache 512 KB 512 KB
L2 cache 4 MB 1 MB
L3 cache 8 MB 6 MB
Manufacturing process technology 7 nm 14 nm
Maximum core temperature 105 °C 100°C
Maximum frequency 4.15 GHz 3.80 GHz
Number of cores 8 4
Number of threads 16 8
64 bit support
Bus Speed 8 GT/s

Memory

ECC memory support
Max memory channels 2 2
Maximum memory bandwidth 63.58 GB/s 41.6 GB/s
Maximum memory size 64 GB 128 GB
Supported memory types DDR4-3200, LPDDR4x-4266 DDR4-2666

Graphics

Graphics max frequency 1600 MHz
iGPU core count 7
Number of pipelines 448
Processor graphics Radeon Vega 7 Intel UHD Graphics 630
Device ID 0x9BC8
Graphics base frequency 350 MHz
Graphics max dynamic frequency 1.10 GHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory 64 GB

Graphics interfaces

DisplayPort
HDMI
Number of displays supported 4 3
DVI
eDP

Graphics image quality

Max resolution over DisplayPort 4096x2160 4096x2304@60Hz
Max resolution over HDMI 1.4 4096x2160 4096x2160@30Hz
4K resolution support
Max resolution over eDP 4096x2304@60Hz

Compatibility

Configurable TDP 10-25 Watt
Max number of CPUs in a configuration 1 1
Sockets supported FP6 FCLGA1200
Thermal Design Power (TDP) 15 Watt 65 Watt
Package Size 37.5mm x 37.5mm
Thermal Solution PCG2015C

Peripherals

Max number of PCIe lanes 20 16
PCI Express revision 3.0 3.0
PCIe configurations Up to 1x16, 2x8, 1x8+2x4
Scalability 1S Only

Graphics API support

DirectX 12
OpenGL 4.5

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel SSE4.1, Intel SSE4.2, Intel AVX2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)