Intel Core i3-10100E vs AMD Ryzen 7 PRO 4750U

Comparative analysis of Intel Core i3-10100E and AMD Ryzen 7 PRO 4750U processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps), PassMark - Single thread mark, PassMark - CPU mark.

Intel Core i3-10100E

AMD Ryzen 7 PRO 4750U

Differences

Reasons to consider the Intel Core i3-10100E

2x more maximum memory size: 128 GB vs 64 GB

Maximum memory size	128 GB vs 64 GB

Reasons to consider the AMD Ryzen 7 PRO 4750U

4 more cores, run more applications at once: 8 vs 4
8 more threads: 16 vs 8
Around 8% higher clock speed: 4.1 GHz vs 3.80 GHz
Around 5% higher maximum core temperature: 105 °C vs 100°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
4x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 33% more L3 cache; more data can be stored in the L3 cache for quick access later
Around 8% better performance in PassMark - Single thread mark: 2509 vs 2333
Around 82% better performance in PassMark - CPU mark: 15206 vs 8365

Specifications (specs)
Number of cores	8 vs 4
Number of threads	16 vs 8
Maximum frequency	4.1 GHz vs 3.80 GHz
Maximum core temperature	105 °C vs 100°C
Manufacturing process technology	7 nm vs 14 nm
L2 cache	4 MB vs 1 MB
L3 cache	8 MB vs 6 MB
Benchmarks
PassMark - Single thread mark	2509 vs 2333
PassMark - CPU mark	15206 vs 8365

Compare benchmarks

CPU 1: Intel Core i3-10100E
CPU 2: AMD Ryzen 7 PRO 4750U

PassMark - Single thread mark

CPU 1

CPU 2

2333

2509

PassMark - CPU mark

CPU 1

CPU 2

8365

15206

Name	Intel Core i3-10100E	AMD Ryzen 7 PRO 4750U
GFXBench 4.0 - Car Chase Offscreen (Frames)	1952
GFXBench 4.0 - Car Chase Offscreen (Fps)	1952
GFXBench 4.0 - Manhattan (Frames)	4738
GFXBench 4.0 - Manhattan (Fps)	4738
GFXBench 4.0 - T-Rex (Frames)	8006
GFXBench 4.0 - T-Rex (Fps)	8006
PassMark - Single thread mark	2333	2509
PassMark - CPU mark	8365	15206

Compare specifications (specs)

	Intel Core i3-10100E	AMD Ryzen 7 PRO 4750U
Essentials
Architecture codename	Comet Lake	Zen 2
Launch date	30 Apr 2020	7 May 2020
Launch price (MSRP)	$125
Place in performance rating	276	749
Processor Number	i3-10100E
Series	10th Generation Intel Core i3 Processors	AMD Ryzen 7 PRO 4000
Status	Launched
Vertical segment	Embedded	Laptop
Family		AMD Ryzen PRO
OPN Tray		100-000000101
Performance
64 bit support
Base frequency	3.20 GHz	1.7 GHz
Bus Speed	8 GT/s
L1 cache	512 KB	512 KB
L2 cache	1 MB	4 MB
L3 cache	6 MB	8 MB
Manufacturing process technology	14 nm	7 nm
Maximum core temperature	100°C	105 °C
Maximum frequency	3.80 GHz	4.1 GHz
Number of cores	4	8
Number of threads	8	16
Number of GPU cores		7
Unlocked
Memory
Max memory channels	2	4
Maximum memory bandwidth	41.6 GB/s	68.27 GB/s
Maximum memory size	128 GB	64 GB
Supported memory types	DDR4-2666	DDR4-3200, LPDDR4-4266
Graphics
Device ID	0x9BC8
Graphics base frequency	350 MHz
Graphics max dynamic frequency	1.10 GHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory	64 GB
Processor graphics	Intel UHD Graphics 630	AMD Radeon Graphics
Execution Units		7
Number of pipelines		448
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported	3	4
Graphics image quality
4K resolution support
Max resolution over DisplayPort	4096x2304@60Hz
Max resolution over eDP	4096x2304@60Hz
Max resolution over HDMI 1.4	4096x2160@30Hz
Graphics API support
DirectX	12
OpenGL	4.5
Compatibility
Max number of CPUs in a configuration	1
Package Size	37.5mm x 37.5mm
Sockets supported	FCLGA1200	FP6
Thermal Design Power (TDP)	65 Watt
Thermal Solution	PCG2015C
Configurable TDP		10-25 Watt
Peripherals
Max number of PCIe lanes	16	16
PCI Express revision	3.0	3.0
PCIe configurations	Up to 1x16, 2x8, 1x8+2x4	1x8+1x4+1x4, 2x4+1x4+1x4
Scalability	1S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel SSE4.1, Intel SSE4.2, Intel AVX2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)