Intel Core i3-6100TE vs Intel Core i7-5550U

Comparative analysis of Intel Core i3-6100TE and Intel Core i7-5550U processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps), Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core i3-6100TE

Intel Core i7-5550U

Differences

Reasons to consider the Intel Core i3-6100TE

4x more maximum memory size: 64 GB vs 16 GB
Around 10% better performance in PassMark - CPU mark: 3152 vs 2864

Specifications (specs)
Maximum memory size	64 GB vs 16 GB
Benchmarks
PassMark - CPU mark	3152 vs 2864

Reasons to consider the Intel Core i7-5550U

2.3x lower typical power consumption: 15 Watt vs 35 Watt
Around 4% better performance in PassMark - Single thread mark: 1703 vs 1636

Specifications (specs)
Thermal Design Power (TDP)	15 Watt vs 35 Watt
Benchmarks
PassMark - Single thread mark	1703 vs 1636

Compare benchmarks

CPU 1: Intel Core i3-6100TE
CPU 2: Intel Core i7-5550U

PassMark - Single thread mark

CPU 1

CPU 2

1636

1703

PassMark - CPU mark

CPU 1

CPU 2

3152

2864

Name	Intel Core i3-6100TE	Intel Core i7-5550U
PassMark - Single thread mark	1636	1703
PassMark - CPU mark	3152	2864
GFXBench 4.0 - Car Chase Offscreen (Frames)	1662
GFXBench 4.0 - Car Chase Offscreen (Fps)	1662
GFXBench 4.0 - Manhattan (Frames)	3412
GFXBench 4.0 - Manhattan (Fps)	3412
GFXBench 4.0 - T-Rex (Frames)	5721
GFXBench 4.0 - T-Rex (Fps)	5721
Geekbench 4 - Single Core		3316
Geekbench 4 - Multi-Core		6083

Compare specifications (specs)

	Intel Core i3-6100TE	Intel Core i7-5550U
Essentials
Architecture codename	Skylake	Broadwell
Launch date	Q4'15	5 January 2015
Place in performance rating	712	852
Processor Number	i3-6100TE	i7-5550U
Series	6th Generation Intel® Core™ i3 Processors	5th Generation Intel® Core™ i7 Processors
Status	Launched	Launched
Vertical segment	Embedded	Mobile
Launch price (MSRP)		$426
Performance
64 bit support
Base frequency	2.70 GHz	2.00 GHz
Bus Speed	8 GT/s DMI3	5 GT/s DMI2
Manufacturing process technology	14 nm	14 nm
Number of cores	2	2
Number of threads	4	4
Die size		133 mm
L1 cache		128 KB
L2 cache		512 KB
L3 cache		4 MB
Maximum case temperature (TCase)		105 °C
Maximum core temperature		105°C
Maximum frequency		3.00 GHz
Transistor count		1900 Million
Memory
Max memory channels	2	2
Maximum memory bandwidth	34.1 GB/s	25.6 GB/s
Maximum memory size	64 GB	16 GB
Supported memory types	DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V	DDR3L 1333/1600, LPDDR3 1600/1866
Graphics
Device ID	0x1912	0x1626
Graphics base frequency	350 MHz	300 MHz
Graphics max dynamic frequency	1.00 GHz	1.00 GHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory	64 GB	16 GB
Processor graphics	Intel® HD Graphics 530	Intel® HD Graphics 6000
Graphics max frequency		1 GHz
Intel® Flexible Display Interface (Intel® FDI)
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported	3	3
Wireless Display (WiDi) support
Graphics image quality
4K resolution support
Max resolution over DisplayPort	4096x2304@60Hz	3840x2160@60Hz
Max resolution over eDP	4096x2304@60Hz
Max resolution over HDMI 1.4	4096x2304@24Hz	2560x1600@60Hz
Graphics API support
DirectX	12	11.2/12
OpenGL	4.5	4.3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm	40mm x24mm x 1.3mm
Sockets supported	FCLGA1151	FCBGA1168
Thermal Design Power (TDP)	35 Watt	15 Watt
Thermal Solution	PCG 2015A (35W)
Configurable TDP-down		9.5 W
Configurable TDP-down Frequency		600 MHz
Peripherals
Max number of PCIe lanes	16	12
PCI Express revision	3.0	2.0
PCIe configurations	Up to 1x16, 2x8, 1x8+2x4	4x1, 2x4
Scalability	1S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Memory Protection Extensions (Intel® MPX)
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Flexible Display interface (FDI)
Intel® Advanced Vector Extensions (AVX)
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Smart Response technology
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)