Intel Xeon Gold 6142 vs AMD Opteron 4332 HE

Comparative analysis of Intel Xeon Gold 6142 and AMD Opteron 4332 HE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Xeon Gold 6142

  • 10 more cores, run more applications at once: 16 vs 6
  • 26 more threads: 32 vs 6
  • Around 25% higher maximum core temperature: 85°C vs 68°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
  • Around 62% better performance in PassMark - Single thread mark: 2087 vs 1285
  • 6.5x better performance in PassMark - CPU mark: 36651 vs 5614
Specifications (specs)
Number of cores 16 vs 6
Number of threads 32 vs 6
Maximum core temperature 85°C vs 68°C
Manufacturing process technology 14 nm vs 32 nm
Benchmarks
PassMark - Single thread mark 2087 vs 1285
PassMark - CPU mark 36651 vs 5614

Reasons to consider the AMD Opteron 4332 HE

  • 2.3x lower typical power consumption: 65 Watt vs 150 Watt
Thermal Design Power (TDP) 65 Watt vs 150 Watt

Compare benchmarks

CPU 1: Intel Xeon Gold 6142
CPU 2: AMD Opteron 4332 HE

PassMark - Single thread mark
CPU 1
CPU 2
2087
1285
PassMark - CPU mark
CPU 1
CPU 2
36651
5614
Name Intel Xeon Gold 6142 AMD Opteron 4332 HE
Geekbench 4 - Single Core 4001
Geekbench 4 - Multi-Core 32370
PassMark - Single thread mark 2087 1285
PassMark - CPU mark 36651 5614

Compare specifications (specs)

Intel Xeon Gold 6142 AMD Opteron 4332 HE

Essentials

Architecture codename Skylake Seoul
Launch date Q3'17 n/d
Place in performance rating 68 1728
Processor Number 6142
Series Intel® Xeon® Scalable Processors AMD Opteron 4300 Series Processor
Status Launched
Vertical segment Server Server
Family AMD Opteron
OPN Tray OS4332OFU6KHK

Performance

Base frequency 2.60 GHz 3 GHz
Manufacturing process technology 14 nm 32 nm
Maximum core temperature 85°C 68°C
Maximum frequency 3.70 GHz 3.7 GHz
Number of cores 16 6
Number of threads 32 6
Number of Ultra Path Interconnect (UPI) Links 3
64 bit support
Die size 315 mm
L1 cache 288 KB
L2 cache 6 MB
L3 cache 8 MB
Transistor count 1200 million
Unlocked

Memory

Max memory channels 6
Maximum memory size 768 GB
Supported memory frequency 2666 MHz 2000 MHz
Supported memory types DDR4-2666 DDR3

Compatibility

Low Halogen Options Available
Package Size 76.0mm x 56.5mm
Sockets supported FCLGA3647 C32
Thermal Design Power (TDP) 150 Watt 65 Watt
Max number of CPUs in a configuration 2

Peripherals

Max number of PCIe lanes 48
PCI Express revision 3.0
Scalability S4S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Instruction set extensions Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units 2
Speed Shift technology
Fused Multiply-Add (FMA)
Intel® Advanced Vector Extensions (AVX)

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)