Intel Xeon Platinum 8176 vs AMD EPYC 7371
Comparative analysis of Intel Xeon Platinum 8176 and AMD EPYC 7371 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon Platinum 8176
- 12 more cores, run more applications at once: 28 vs 16
- 24 more threads: 56 vs 32
- Around 21% lower typical power consumption: 165 Watt vs 200 Watt
- Around 73% better performance in PassMark - CPU mark: 53835 vs 31094
Specifications (specs) | |
Number of cores | 28 vs 16 |
Number of threads | 56 vs 32 |
Thermal Design Power (TDP) | 165 Watt vs 200 Watt |
Benchmarks | |
PassMark - CPU mark | 53835 vs 31094 |
Reasons to consider the AMD EPYC 7371
- Around 17% better performance in PassMark - Single thread mark: 2377 vs 2040
Benchmarks | |
PassMark - Single thread mark | 2377 vs 2040 |
Compare benchmarks
CPU 1: Intel Xeon Platinum 8176
CPU 2: AMD EPYC 7371
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon Platinum 8176 | AMD EPYC 7371 |
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PassMark - Single thread mark | 2040 | 2377 |
PassMark - CPU mark | 53835 | 31094 |
Compare specifications (specs)
Intel Xeon Platinum 8176 | AMD EPYC 7371 | |
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Essentials |
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Architecture codename | Skylake | |
Launch date | Q3'17 | |
Place in performance rating | 449 | 593 |
Processor Number | 8176 | |
Series | Intel® Xeon® Scalable Processors | AMD EPYC 7000 Series |
Status | Launched | |
Vertical segment | Server | Server |
Family | AMD EPYC | |
Performance |
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Base frequency | 2.10 GHz | 3.1 GHz |
Manufacturing process technology | 14 nm | |
Maximum core temperature | 89°C | |
Maximum frequency | 3.80 GHz | 3.8 GHz |
Number of cores | 28 | 16 |
Number of threads | 56 | 32 |
Number of Ultra Path Interconnect (UPI) Links | 3 | |
L3 cache | 64 MB | |
Memory |
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Max memory channels | 6 | 8 |
Maximum memory size | 768 GB | |
Supported memory frequency | 2666 MHz | 2666 MHz |
Supported memory types | DDR4-2666 | DDR4 |
Maximum memory bandwidth | 341 GB/s | |
Compatibility |
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Low Halogen Options Available | ||
Package Size | 76.0mm x 56.5mm | |
Sockets supported | FCLGA3647 | |
Thermal Design Power (TDP) | 165 Watt | 200 Watt |
Socket Count | 1P/2P | |
Peripherals |
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Max number of PCIe lanes | 48 | |
PCI Express revision | 3.0 | x128 |
Scalability | S8S | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Run Sure Technology | ||
Intel® Trusted Execution technology (TXT) | ||
Mode-based Execute Control (MBE) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Instruction set extensions | Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® Volume Management Device (VMD) | ||
Intel® vPro™ Platform Eligibility | ||
Number of AVX-512 FMA Units | 2 | |
Speed Shift technology | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |