Intel Xeon W-1370P vs AMD Ryzen 9 5900HX
Comparative analysis of Intel Xeon W-1370P and AMD Ryzen 9 5900HX processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the Intel Xeon W-1370P
- CPU is newer: launch date 2 month(s) later
- Around 13% higher clock speed: 5.20 GHz vs 4.6 GHz
- Around 10% better performance in PassMark - Single thread mark: 3527 vs 3196
- Around 9% better performance in PassMark - CPU mark: 24540 vs 22606
Specifications (specs) | |
Launch date | 1 Apr 2021 vs 12 Jan 2021 |
Maximum frequency | 5.20 GHz vs 4.6 GHz |
Benchmarks | |
PassMark - Single thread mark | 3527 vs 3196 |
PassMark - CPU mark | 24540 vs 22606 |
Reasons to consider the AMD Ryzen 9 5900HX
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
- 2.8x lower typical power consumption: 45 Watt vs 125 Watt
Manufacturing process technology | 7 nm vs 14 nm |
Thermal Design Power (TDP) | 45 Watt vs 125 Watt |
Compare benchmarks
CPU 1: Intel Xeon W-1370P
CPU 2: AMD Ryzen 9 5900HX
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon W-1370P | AMD Ryzen 9 5900HX |
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PassMark - Single thread mark | 3527 | 3196 |
PassMark - CPU mark | 24540 | 22606 |
3DMark Fire Strike - Physics Score | 6544 |
Compare specifications (specs)
Intel Xeon W-1370P | AMD Ryzen 9 5900HX | |
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Essentials |
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Architecture codename | Rocket Lake | Zen 3 |
Launch date | 1 Apr 2021 | 12 Jan 2021 |
Launch price (MSRP) | $428 - $431 | |
Place in performance rating | 261 | 665 |
Processor Number | W-1370P | |
Series | Intel Xeon W Processor | |
Status | Launched | |
Vertical segment | Workstation | Laptop |
Performance |
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64 bit support | ||
Base frequency | 3.60 GHz | 3.3 GHz |
Bus Speed | 8 GT/s | |
L3 cache | 16 MB | 16 MB |
Manufacturing process technology | 14 nm | 7 nm |
Maximum core temperature | 100°C | |
Maximum frequency | 5.20 GHz | 4.6 GHz |
Number of cores | 8 | 8 |
Number of threads | 16 | 16 |
L1 cache | 512 KB | |
L2 cache | 4 MB | |
Unlocked | ||
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 50 GB/s | 47.68 GB/s |
Maximum memory size | 128 GB | 128 GB |
Supported memory types | DDR4-3200 | DDR4-4266 |
ECC memory support | ||
Graphics |
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Device ID | 0x4C90 | |
Execution Units | 32 | |
Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.30 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Processor graphics | Intel UHD Graphics P750 | |
Graphics interfaces |
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Number of displays supported | 3 | |
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 5120 x 3200 @60Hz | |
Max resolution over eDP | 5120 x 3200 @60Hz | |
Graphics API support |
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DirectX | 12.1 | |
OpenGL | 4.5 | |
Compatibility |
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Configurable TDP-down | 95 Watt | |
Configurable TDP-down Frequency | 3.10 GHz | |
Max number of CPUs in a configuration | 1 | |
Package Size | 37.5 mm x 37.5 mm | |
Sockets supported | FCLGA1200 | FP6 |
Thermal Design Power (TDP) | 125 Watt | 45 Watt |
Thermal Solution | PCG 2019A | |
Peripherals |
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Max number of PCIe lanes | 20 | 20 |
PCI Express revision | 4.0 | 4.0 |
PCIe configurations | Up to 1x16+1x4, 2x8+1x4, 1x8+3x4 | 1x16+x4, 2x8+x4, 1x8+2x4+x4 |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2, Intel AVX-512 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Thermal Velocity Boost | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
AMD SenseMI | ||
AMD StoreMI technology | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) |