Intel Xeon W-3245 vs Intel Xeon E3-1275 v3

Comparative analysis of Intel Xeon W-3245 and Intel Xeon E3-1275 v3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics, Graphics interfaces. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark, CompuBench 1.5 Desktop - Face Detection (mPixels/s).

Intel Xeon W-3245

Intel Xeon E3-1275 v3

Differences

Reasons to consider the Intel Xeon W-3245

CPU is newer: launch date 6 year(s) 0 month(s) later
12 more cores, run more applications at once: 16 vs 4
24 more threads: 32 vs 8
Around 13% higher clock speed: 4.40 GHz vs 3.90 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
4x more L1 cache, more data can be stored in the L1 cache for quick access later
16x more L2 cache, more data can be stored in the L2 cache for quick access later
2.8x more L3 cache, more data can be stored in the L3 cache for quick access later
32x more maximum memory size: 1 TB vs 32 GB
Around 23% better performance in Geekbench 4 - Single Core: 1118 vs 909
4.2x better performance in Geekbench 4 - Multi-Core: 14290 vs 3422
Around 16% better performance in PassMark - Single thread mark: 2570 vs 2225
4.2x better performance in PassMark - CPU mark: 30551 vs 7275

Specifications (specs)
Launch date	3 Jun 2019 vs June 2013
Number of cores	16 vs 4
Number of threads	32 vs 8
Maximum frequency	4.40 GHz vs 3.90 GHz
Manufacturing process technology	14 nm vs 22 nm
L1 cache	1 MB vs 64 KB (per core)
L2 cache	16 MB vs 256 KB (per core)
L3 cache	22 MB vs 8192 KB (shared)
Maximum memory size	1 TB vs 32 GB
Benchmarks
Geekbench 4 - Single Core	1118 vs 909
Geekbench 4 - Multi-Core	14290 vs 3422
PassMark - Single thread mark	2570 vs 2225
PassMark - CPU mark	30551 vs 7275

Reasons to consider the Intel Xeon E3-1275 v3

2.4x lower typical power consumption: 84 Watt vs 205 Watt

Thermal Design Power (TDP)	84 Watt vs 205 Watt

Compare benchmarks

CPU 1: Intel Xeon W-3245
CPU 2: Intel Xeon E3-1275 v3

Geekbench 4 - Single Core

CPU 1

CPU 2

1118

909

Geekbench 4 - Multi-Core

CPU 1

CPU 2

14290

3422

PassMark - Single thread mark

CPU 1

CPU 2

2570

2225

PassMark - CPU mark

CPU 1

CPU 2

30551

7275

Name	Intel Xeon W-3245	Intel Xeon E3-1275 v3
Geekbench 4 - Single Core	1118	909
Geekbench 4 - Multi-Core	14290	3422
PassMark - Single thread mark	2570	2225
PassMark - CPU mark	30551	7275
CompuBench 1.5 Desktop - Face Detection (mPixels/s)		16.134

Compare specifications (specs)

	Intel Xeon W-3245	Intel Xeon E3-1275 v3
Essentials
Architecture codename	Cascade Lake	Haswell
Launch date	3 Jun 2019	June 2013
Launch price (MSRP)	$1999	$531
Place in performance rating	662	1418
Processor Number	W-3245	E3-1275 v3
Series	Intel Xeon W Processor	Intel® Xeon® Processor E3 v3 Family
Status	Launched	Launched
Vertical segment	Workstation	Server
Price now		$400.99
Value for money (0-100)		7.26
Performance
Base frequency	3.20 GHz	3.50 GHz
L1 cache	1 MB	64 KB (per core)
L2 cache	16 MB	256 KB (per core)
L3 cache	22 MB	8192 KB (shared)
Manufacturing process technology	14 nm	22 nm
Maximum core temperature	77°C
Maximum frequency	4.40 GHz	3.90 GHz
Number of cores	16	4
Number of threads	32	8
Number of Ultra Path Interconnect (UPI) Links	0
64 bit support
Bus Speed		5 GT/s DMI
Die size		160 mm
Number of QPI Links		0
Transistor count		1400 million
Memory
ECC memory support
Max memory channels	6	2
Maximum memory bandwidth	131.13 GB/s	25.6 GB/s
Maximum memory size	1 TB	32 GB
Supported memory frequency	2933 MHz
Supported memory types	DDR4-2933	DDR3 and DDR3L 1333/1600 at 1.5V
Compatibility
Package Size	76.0mm x 56.5mm	37.5mm x 37.5mm
Sockets supported	FCLGA3647	FCLGA1150
Thermal Design Power (TDP)	205 Watt	84 Watt
Low Halogen Options Available
Max number of CPUs in a configuration		1
Thermal Solution		PCG 2013D
Peripherals
Max number of PCIe lanes	64	16
PCI Express revision	3.0	3.0
Scalability	1S Only	1S Only
PCIe configurations		1x16, 2x8, 1x8/2x4
Security & Reliability
Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)
Secure Boot
Anti-Theft technology
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Advanced Technologies
Enhanced Intel SpeedStep® technology
Instruction set extensions	Intel AVX-512	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units	2
Speed Shift technology
Flexible Display interface (FDI)
Idle States
Intel® Advanced Vector Extensions (AVX)
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Stable Image Platform Program (SIPP)
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Graphics
Graphics base frequency		350 MHz
Graphics max dynamic frequency		1.25 GHz
Graphics max frequency		1.25 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics		Intel HD Graphics P4600
Graphics interfaces
Number of displays supported		3