AMD FirePro S9300 X2 vs AMD FireStream 9370

Comparative analysis of AMD FirePro S9300 X2 and AMD FireStream 9370 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: Geekbench - OpenCL, PassMark - G2D Mark, PassMark - G3D Mark.

 

Differences

Reasons to consider the AMD FirePro S9300 X2

  • Videocard is newer: launch date 5 year(s) 9 month(s) later
  • Around 3% higher core clock speed: 850 MHz vs 825 MHz
  • 33.6x more texture fill rate: 2x 217.6 GTexel / s billion / sec vs 66.0 GTexel / s
  • 5.1x more pipelines: 2x 4096 vs 1600
  • 5.3x better floating-point performance: 2x 6,963 gflops vs 2,640.0 gflops
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 28 nm vs 40 nm
  • 2x more maximum memory size: 2x 4 GB vs 4 GB
Launch date 31 March 2016 vs 23 June 2010
Core clock speed 850 MHz vs 825 MHz
Texture fill rate 2x 217.6 GTexel / s billion / sec vs 66.0 GTexel / s
Pipelines 2x 4096 vs 1600
Floating-point performance 2x 6,963 gflops vs 2,640.0 gflops
Manufacturing process technology 28 nm vs 40 nm
Maximum memory size 2x 4 GB vs 4 GB

Reasons to consider the AMD FireStream 9370

  • Around 33% lower typical power consumption: 225 Watt vs 300 Watt
  • 4.6x more memory clock speed: 4600 MHz vs 1000 MHz
Thermal Design Power (TDP) 225 Watt vs 300 Watt
Memory clock speed 4600 MHz vs 1000 MHz

Compare benchmarks

GPU 1: AMD FirePro S9300 X2
GPU 2: AMD FireStream 9370

Name AMD FirePro S9300 X2 AMD FireStream 9370
Geekbench - OpenCL 27971
PassMark - G2D Mark 763
PassMark - G3D Mark 2528

Compare specifications (specs)

AMD FirePro S9300 X2 AMD FireStream 9370

Essentials

Architecture GCN 3.0 TeraScale 2
Code name Capsaicin Cypress
Launch date 31 March 2016 23 June 2010
Launch price (MSRP) $5,999
Place in performance rating 852 129
Type Workstation Desktop

Technical info

Core clock speed 850 MHz 825 MHz
Floating-point performance 2x 6,963 gflops 2,640.0 gflops
Manufacturing process technology 28 nm 40 nm
Pipelines 2x 4096 1600
Texture fill rate 2x 217.6 GTexel / s billion / sec 66.0 GTexel / s
Thermal Design Power (TDP) 300 Watt 225 Watt
Transistor count 8,900 million 2,154 million

Video outputs and ports

Display Connectors No outputs 1x DisplayPort

Compatibility, dimensions and requirements

Interface PCIe 3.0 x16 PCIe 2.0 x16
Length 267 mm 267 mm
Supplementary power connectors 2x 8-pin 1x 6-pin + 1x 8-pin

API support

DirectX 12.0 (12_0) 11.2 (11_0)
OpenGL 4.5 4.4

Memory

Maximum RAM amount 2x 4 GB 4 GB
Memory bandwidth 2x 512.0 GB / s 147.2 GB / s
Memory bus width 2x 4096 Bit 256 Bit
Memory clock speed 1000 MHz 4600 MHz
Memory type HBM GDDR5