AMD FirePro S9300 X2 vs AMD Radeon R9 290X2
Comparative analysis of AMD FirePro S9300 X2 and AMD Radeon R9 290X2 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: Geekbench - OpenCL, CompuBench 1.5 Desktop - T-Rex (Frames/s).
Differences
Reasons to consider the AMD FirePro S9300 X2
- Videocard is newer: launch date 1 year(s) 9 month(s) later
- Around 2% higher texture fill rate: 2x 217.6 GTexel / s billion / sec vs 2x 176.0 GTexel / s billion / sec
- Around 45% higher pipelines: 2x 4096 vs 2x 2816
- Around 24% better floating-point performance: 2x 6,963 gflops vs 2x 5,632 gflops
- Around 93% lower typical power consumption: 300 Watt vs 580 Watt
Launch date | 31 March 2016 vs 24 June 2014 |
Texture fill rate | 2x 217.6 GTexel / s billion / sec vs 2x 176.0 GTexel / s billion / sec |
Pipelines | 2x 4096 vs 2x 2816 |
Floating-point performance | 2x 6,963 gflops vs 2x 5,632 gflops |
Thermal Design Power (TDP) | 300 Watt vs 580 Watt |
Reasons to consider the AMD Radeon R9 290X2
- Around 18% higher core clock speed: 1000 MHz vs 850 MHz
- 5.4x more memory clock speed: 5400 MHz vs 1000 MHz
Core clock speed | 1000 MHz vs 850 MHz |
Memory clock speed | 5400 MHz vs 1000 MHz |
Compare benchmarks
GPU 1: AMD FirePro S9300 X2
GPU 2: AMD Radeon R9 290X2
Name | AMD FirePro S9300 X2 | AMD Radeon R9 290X2 |
---|---|---|
Geekbench - OpenCL | 27971 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 19.441 |
Compare specifications (specs)
AMD FirePro S9300 X2 | AMD Radeon R9 290X2 | |
---|---|---|
Essentials |
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Architecture | GCN 3.0 | GCN 2.0 |
Code name | Capsaicin | Hawaii |
Launch date | 31 March 2016 | 24 June 2014 |
Launch price (MSRP) | $5,999 | $1,399 |
Place in performance rating | 841 | 282 |
Type | Workstation | Desktop |
Technical info |
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Core clock speed | 850 MHz | 1000 MHz |
Floating-point performance | 2x 6,963 gflops | 2x 5,632 gflops |
Manufacturing process technology | 28 nm | 28 nm |
Pipelines | 2x 4096 | 2x 2816 |
Texture fill rate | 2x 217.6 GTexel / s billion / sec | 2x 176.0 GTexel / s billion / sec |
Thermal Design Power (TDP) | 300 Watt | 580 Watt |
Transistor count | 8,900 million | 6,200 million |
Video outputs and ports |
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Display Connectors | No outputs | 2x DVI, 1x HDMI, 1x DisplayPort |
Compatibility, dimensions and requirements |
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Interface | PCIe 3.0 x16 | PCIe 3.0 x16 |
Length | 267 mm | |
Supplementary power connectors | 2x 8-pin | 4x 8-pin |
API support |
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DirectX | 12.0 (12_0) | 12.0 (12_0) |
OpenGL | 4.5 | 4.6 |
Memory |
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Maximum RAM amount | 2x 4 GB | 2x 4 GB |
Memory bandwidth | 2x 512.0 GB / s | 2x 345.6 GB / s |
Memory bus width | 2x 4096 Bit | 2x 512 Bit |
Memory clock speed | 1000 MHz | 5400 MHz |
Memory type | HBM | GDDR5 |