AMD Radeon Pro VII vs AMD FirePro S9300 X2
Comparative analysis of AMD Radeon Pro VII and AMD FirePro S9300 X2 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: Geekbench - OpenCL.
Differences
Reasons to consider the AMD Radeon Pro VII
- Videocard is newer: launch date 4 year(s) 1 month(s) later
- Around 65% higher core clock speed: 1400 MHz vs 850 MHz
- 184x more texture fill rate: 408 GTexel/s vs 2x 217.6 GTexel / s billion / sec
- A newer manufacturing process allows for a more powerful, yet cooler running videocard: 7 nm vs 28 nm
- Around 20% lower typical power consumption: 250 Watt vs 300 Watt
- 2x more maximum memory size: 16 GB vs 2x 4 GB
- 3.2x better performance in Geekbench - OpenCL: 90077 vs 27971
Specifications (specs) | |
Launch date | 13 May 2020 vs 31 March 2016 |
Core clock speed | 1400 MHz vs 850 MHz |
Texture fill rate | 408 GTexel/s vs 2x 217.6 GTexel / s billion / sec |
Manufacturing process technology | 7 nm vs 28 nm |
Thermal Design Power (TDP) | 250 Watt vs 300 Watt |
Maximum memory size | 16 GB vs 2x 4 GB |
Benchmarks | |
Geekbench - OpenCL | 90077 vs 27971 |
Reasons to consider the AMD FirePro S9300 X2
- 2.1x more pipelines: 2x 4096 vs 3840
Pipelines | 2x 4096 vs 3840 |
Compare benchmarks
GPU 1: AMD Radeon Pro VII
GPU 2: AMD FirePro S9300 X2
Geekbench - OpenCL |
|
|
Name | AMD Radeon Pro VII | AMD FirePro S9300 X2 |
---|---|---|
Geekbench - OpenCL | 90077 | 27971 |
Compare specifications (specs)
AMD Radeon Pro VII | AMD FirePro S9300 X2 | |
---|---|---|
Essentials |
||
Architecture | GCN 5.1 | GCN 3.0 |
Code name | Vega 20 | Capsaicin |
Launch date | 13 May 2020 | 31 March 2016 |
Launch price (MSRP) | $1899 | $5,999 |
Place in performance rating | 189 | 852 |
Type | Desktop | Workstation |
Technical info |
||
Boost clock speed | 1700 MHz | |
Compute units | 60 | |
Core clock speed | 1400 MHz | 850 MHz |
Manufacturing process technology | 7 nm | 28 nm |
Peak Double Precision (FP64) Performance | 6.528 TFLOPS (1:2) | |
Peak Half Precision (FP16) Performance | 26.11 TFLOPS (2:1) | |
Peak Single Precision (FP32) Performance | 13.06 TFLOPS | |
Pipelines | 3840 | 2x 4096 |
Pixel fill rate | 108.8 GPixel/s | |
Texture fill rate | 408 GTexel/s | 2x 217.6 GTexel / s billion / sec |
Thermal Design Power (TDP) | 250 Watt | 300 Watt |
Transistor count | 13230 million | 8,900 million |
Floating-point performance | 2x 6,963 gflops | |
Video outputs and ports |
||
Display Connectors | 6x mini-DisplayPort | No outputs |
Compatibility, dimensions and requirements |
||
Form factor | Dual-slot | |
Interface | PCIe 4.0 x16 | PCIe 3.0 x16 |
Length | 305 mm (12 inches) | 267 mm |
Recommended system power (PSU) | 600 Watt | |
Supplementary power connectors | 1x 6-pin + 1x 8-pin | 2x 8-pin |
Width | 111 mm (4.4 inches) | |
API support |
||
DirectX | 12.1 | 12.0 (12_0) |
OpenCL | 2.1 | |
OpenGL | 4.6 | 4.5 |
Shader Model | 6.4 | |
Vulkan | ||
Memory |
||
High bandwidth memory (HBM) | ||
Maximum RAM amount | 16 GB | 2x 4 GB |
Memory bandwidth | 1024 GB/s | 2x 512.0 GB / s |
Memory bus width | 4096 bit | 2x 4096 Bit |
Memory clock speed | 1000 MHz (2 Gbps effective) | 1000 MHz |
Memory type | HBM2 | HBM |