AMD Radeon RX Vega 11 Mobile vs AMD Radeon R8 M350DX

Comparative analysis of AMD Radeon RX Vega 11 Mobile and AMD Radeon R8 M350DX videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: 3DMark Fire Strike - Graphics Score, GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), Geekbench - OpenCL, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the AMD Radeon RX Vega 11 Mobile

  • Videocard is newer: launch date 2 year(s) 5 month(s) later
  • Around 21% higher boost clock speed: 1250 MHz vs 1030 MHz
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 14 nm vs 28 nm
Launch date 15 May 2018 vs 12 December 2015
Boost clock speed 1250 MHz vs 1030 MHz
Manufacturing process technology 14 nm vs 28 nm

Reasons to consider the AMD Radeon R8 M350DX

  • 3.2x more core clock speed: 955 MHz vs 300 MHz
  • Around 13% better performance in 3DMark Fire Strike - Graphics Score: 1330 vs 1177
Specifications (specs)
Core clock speed 955 MHz vs 300 MHz
Benchmarks
3DMark Fire Strike - Graphics Score 1330 vs 1177

Compare benchmarks

GPU 1: AMD Radeon RX Vega 11 Mobile
GPU 2: AMD Radeon R8 M350DX

3DMark Fire Strike - Graphics Score
GPU 1
GPU 2
1177
1330
Name AMD Radeon RX Vega 11 Mobile AMD Radeon R8 M350DX
3DMark Fire Strike - Graphics Score 1177 1330
GFXBench 4.0 - Manhattan (Frames) 1843
GFXBench 4.0 - Manhattan (Fps) 1843
Geekbench - OpenCL 19471
GFXBench 4.0 - T-Rex (Frames) 1662
GFXBench 4.0 - T-Rex (Fps) 1662

Compare specifications (specs)

AMD Radeon RX Vega 11 Mobile AMD Radeon R8 M350DX

Essentials

Architecture GCN 5.0 GCN 1.0
Code name Raven Jet
Launch date 15 May 2018 12 December 2015
Place in performance rating 1453 1275
Type Desktop Desktop

Technical info

Boost clock speed 1250 MHz 1030 MHz
Core clock speed 300 MHz 955 MHz
Floating-point performance 1,830 gflops
Manufacturing process technology 14 nm 28 nm
Pipelines 704
Texture fill rate 57.2 GTexel / s
Thermal Design Power (TDP) 35 Watt
Transistor count 4,940 million 1,040 million

Video outputs and ports

Display Connectors No outputs No outputs

Compatibility, dimensions and requirements

Interface IGP IGP

API support

DirectX 12.0 (12_1) 12.0 (11_1)
OpenGL 4.6 4.5

Memory

Maximum RAM amount 256 MB
Memory bandwidth 12.8 GB / s
Memory bus width 128 Bit
Memory type DDR4