Intel UHD Graphics G1 (Ice Lake 32 EU) vs ATI Radeon X600 SE

Comparative analysis of Intel UHD Graphics G1 (Ice Lake 32 EU) and ATI Radeon X600 SE videocards for all known characteristics in the following categories: Essentials, Technical info, API support, Memory, Technologies, Video outputs and ports, Compatibility, dimensions and requirements. Benchmark videocards performance analysis: GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps), PassMark - G2D Mark, PassMark - G3D Mark.

 

Differences

Reasons to consider the Intel UHD Graphics G1 (Ice Lake 32 EU)

  • Videocard is newer: launch date 14 year(s) 8 month(s) later
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 10 nm vs 110 nm
  • Around 44% lower typical power consumption: 25 Watt vs 36 Watt
Launch date 28 May 2019 vs 1 September 2004
Manufacturing process technology 10 nm vs 110 nm
Thermal Design Power (TDP) 25 Watt vs 36 Watt

Reasons to consider the ATI Radeon X600 SE

  • Around 8% higher core clock speed: 325 MHz vs 300 MHz
Core clock speed 325 MHz vs 300 MHz

Compare benchmarks

GPU 1: Intel UHD Graphics G1 (Ice Lake 32 EU)
GPU 2: ATI Radeon X600 SE

Name Intel UHD Graphics G1 (Ice Lake 32 EU) ATI Radeon X600 SE
GFXBench 4.0 - Car Chase Offscreen (Frames) 1887
GFXBench 4.0 - Car Chase Offscreen (Fps) 1887
GFXBench 4.0 - Manhattan (Frames) 3505
GFXBench 4.0 - Manhattan (Fps) 3505
GFXBench 4.0 - T-Rex (Frames) 3352
GFXBench 4.0 - T-Rex (Fps) 3352
PassMark - G2D Mark 229
PassMark - G3D Mark 49

Compare specifications (specs)

Intel UHD Graphics G1 (Ice Lake 32 EU) ATI Radeon X600 SE

Essentials

Architecture Intel Gen. 11 (Ice Lake) Rage 9
Code name Ice Lake G1 Gen. 11 RV370
Launch date 28 May 2019 1 September 2004
Place in performance rating 884 764
Type Laptop Desktop

Technical info

Boost clock speed 1100 MHz
Core clock speed 300 MHz 325 MHz
Manufacturing process technology 10 nm 110 nm
Pipelines 32
Thermal Design Power (TDP) 25 Watt 36 Watt
Texture fill rate 1.3 GTexel / s
Transistor count 107 million

API support

DirectX 12.1 9.0
OpenGL 2.0

Memory

Memory type DDR4 DDR
Shared memory Yes
Maximum RAM amount 128 MB
Memory bandwidth 4 GB / s
Memory bus width 64 Bit
Memory clock speed 500 MHz

Technologies

Quick Sync

Video outputs and ports

Display Connectors 1x DVI, 1x S-Video

Compatibility, dimensions and requirements

Interface PCIe 1.0 x16
Supplementary power connectors None