Intel UHD Graphics G1 (Ice Lake 32 EU) vs NVIDIA GeForce Go 6100 + nForce Go 430

Comparative analysis of Intel UHD Graphics G1 (Ice Lake 32 EU) and NVIDIA GeForce Go 6100 + nForce Go 430 videocards for all known characteristics in the following categories: Essentials, Technical info, API support, Memory, Technologies, Video outputs and ports, Compatibility, dimensions and requirements. Benchmark videocards performance analysis: GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps), PassMark - G2D Mark, PassMark - G3D Mark.

 

Differences

Reasons to consider the Intel UHD Graphics G1 (Ice Lake 32 EU)

  • Videocard is newer: launch date 13 year(s) 3 month(s) later
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 10 nm vs 110 nm
Launch date 28 May 2019 vs 1 February 2006
Manufacturing process technology 10 nm vs 110 nm

Reasons to consider the NVIDIA GeForce Go 6100 + nForce Go 430

  • Around 42% higher core clock speed: 425 MHz vs 300 MHz
Core clock speed 425 MHz vs 300 MHz

Compare benchmarks

GPU 1: Intel UHD Graphics G1 (Ice Lake 32 EU)
GPU 2: NVIDIA GeForce Go 6100 + nForce Go 430

Name Intel UHD Graphics G1 (Ice Lake 32 EU) NVIDIA GeForce Go 6100 + nForce Go 430
GFXBench 4.0 - Car Chase Offscreen (Frames) 1887
GFXBench 4.0 - Car Chase Offscreen (Fps) 1887
GFXBench 4.0 - Manhattan (Frames) 3505
GFXBench 4.0 - Manhattan (Fps) 3505
GFXBench 4.0 - T-Rex (Frames) 3352
GFXBench 4.0 - T-Rex (Fps) 3352
PassMark - G2D Mark 181
PassMark - G3D Mark 18

Compare specifications (specs)

Intel UHD Graphics G1 (Ice Lake 32 EU) NVIDIA GeForce Go 6100 + nForce Go 430

Essentials

Architecture Intel Gen. 11 (Ice Lake) Curie
Code name Ice Lake G1 Gen. 11 C51M
Launch date 28 May 2019 1 February 2006
Place in performance rating 884 959
Type Laptop Desktop

Technical info

Boost clock speed 1100 MHz
Core clock speed 300 MHz 425 MHz
Manufacturing process technology 10 nm 110 nm
Pipelines 32
Thermal Design Power (TDP) 25 Watt
Transistor count 75 million

API support

DirectX 12.1 9.0c
OpenGL 2.1

Memory

Memory type DDR4
Shared memory Yes

Technologies

Quick Sync

Video outputs and ports

Display Connectors No outputs

Compatibility, dimensions and requirements

Interface PCIe 1.0 x16