Nom de code de l’architecture |
Tiger Lake |
Comet Lake |
Date de sortie |
11 May 2021 |
1 Apr 2020 |
Prix de sortie (MSRP) |
$546 |
$539 |
Position dans l’évaluation de la performance |
719 |
390 |
Processor Number |
i9-11900H |
W-1290P |
Série |
11th Generation Intel Core i9 Processors |
Intel Xeon W Processor |
Status |
Launched |
Launched |
Segment vertical |
Mobile |
Workstation |
Soutien de 64-bit |
|
|
Bus Speed |
8 GT/s |
8 GT/s |
Front-side bus (FSB) |
24 MB |
|
Cache L1 |
768 KB |
|
Cache L2 |
10 MB |
|
Processus de fabrication |
10 nm SuperFin |
14 nm |
Température de noyau maximale |
100°C |
100°C |
Fréquence maximale |
4.90 GHz |
5.30 GHz |
Nombre de noyaux |
8 |
10 |
Nombre de fils |
16 |
20 |
Base frequency |
|
3.70 GHz |
Cache L3 |
|
20 MB |
Réseaux de mémoire maximale |
2 |
2 |
Bande passante de mémoire maximale |
51.2 GB/s |
45.8 GB/s |
Taille de mémore maximale |
128 GB |
128 GB |
Genres de mémoire soutenus |
Up to 3200 MT/s |
DDR4-2933 |
Device ID |
0x9A60 |
0x9BC6 |
Unités d’éxécution |
32 |
|
Graphics base frequency |
350 MHz |
350 MHz |
Graphics max dynamic frequency |
1.45 GHz |
1.20 GHz |
Intel® Quick Sync Video |
|
|
Graphiques du processeur |
Intel UHD Graphics for 11th Gen Intel Processors |
Intel UHD Graphics P630 |
Technologie Intel® Clear Video HD |
|
|
Technologie Intel® Clear Video |
|
|
Technologie Intel® InTru™ 3D |
|
|
Mémoire de vidéo maximale |
|
64 GB |
Nombre d’écrans soutenu |
4 |
3 |
Résolution maximale sur DisplayPort |
7680x4320@60Hz |
4096x2304@60Hz |
Résolution maximale sur eDP |
4096x2304@60Hz |
4096x2304@60Hz |
Soutien de la resolution 4K |
|
|
DirectX |
12.1 |
12 |
OpenGL |
4.6 |
4.5 |
Configurable TDP-down |
35 Watt |
95 Watt |
Configurable TDP-down Frequency |
2.10 GHz |
3.30 GHz |
Configurable TDP-up |
45 Watt |
|
Configurable TDP-up Frequency |
2.50 GHz |
|
Nombre de CPUs maximale dans une configuration |
1 |
1 |
Package Size |
50 x 26.5 |
37.5mm x 37.5mm |
Prise courants soutenu |
FCBGA1787 |
FCLGA1200 |
Thermal Design Power (TDP) |
|
125 Watt |
Thermal Solution |
|
PCG 2015D |
Nombre maximale des voies PCIe |
20 |
16 |
PCIe configurations |
Up to 1x16+1x4, 2x8+1x4, 1x8+3x4 |
Up to 1x16, 2x8, 1x8+2x4 |
Révision PCI Express |
|
3.0 |
Scalability |
|
1S Only |
Intel® OS Guard |
|
|
Technologie Intel® Secure Key |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Mode-based Execute Control (MBE) |
|
|
Secure Boot |
|
|
Execute Disable Bit (EDB) |
|
|
Technologie Intel® Identity Protection |
|
|
Technologie Intel® Trusted Execution (TXT) |
|
|
Extensions de l’ensemble d’instructions |
Intel SSE4.1, Intel SSE4.2, Intel AVX2, Intel AVX-512 |
Intel SSE4.1, Intel SSE4.2, Intel AVX2 |
Intel® AES New Instructions |
|
|
Intel® Flex Memory Access |
|
|
Technologie Intel® Hyper-Threading |
|
|
Intel® Optane™ Memory Supported |
|
|
Intel® Volume Management Device (VMD) |
|
|
Speed Shift technology |
|
|
Thermal Monitoring |
|
|
Technologie Enhanced Intel SpeedStep® |
|
|
Idle States |
|
|
Intel 64 |
|
|
Intel® Thermal Velocity Boost |
|
|
Technologie Intel® Turbo Boost |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|