Intel Atom Z2460 processor review
Atom Z2460 processor released by Intel; release date: January 2012. The processor is designed for mobile-computers and based on Penwell microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 1, threads - 2. Maximum CPU clock speed - 1.60 GHz. Maximum operating temperature - 90. Manufacturing process technology - 32 nm. Cache size: L1 - 64 KB (per core), L2 - 512 KB (per core).
Supported memory types: LPDDR2 800. Maximum memory size: 2 GB.
Supported socket types: Intel BGA 617. Maximum number of processors in a configuration - 1. Power consumption (TDP): 3 Watt.
The processor has integrated graphics Integrated.
Specifications (specs)
Essentials |
|
Architecture codename | Penwell |
Launch date | January 2012 |
Place in performance rating | not rated |
Processor Number | Z2460 |
Series | Intel® Atom™ Processor Z Series |
Status | Discontinued |
Vertical segment | Mobile |
Performance |
|
Die size | 65 mm |
L1 cache | 64 KB (per core) |
L2 cache | 512 KB (per core) |
Manufacturing process technology | 32 nm |
Maximum core temperature | 90 |
Maximum frequency | 1.60 GHz |
Number of cores | 1 |
Number of threads | 2 |
Transistor count | 140 million |
VID voltage range | 0.3V - 1.2V |
Memory |
|
Max memory channels | 2 |
Maximum memory bandwidth | 6.4 GB/s |
Maximum memory size | 2 GB |
Supported memory types | LPDDR2 800 |
Graphics |
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Graphics base frequency | 400 MHz |
Processor graphics | Integrated |
Graphics interfaces |
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HDMI | |
Number of displays supported | 2 |
Compatibility |
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Low Halogen Options Available | |
Max number of CPUs in a configuration | 1 |
Package Size | 12mm x 12mm |
Sockets supported | Intel BGA 617 |
Thermal Design Power (TDP) | 3 Watt |
Peripherals |
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Number of USB ports | 1 |
UART | |
USB revision | 2.0 OTG |
Security & Reliability |
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Execute Disable Bit (EDB) | |
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | |
General-Purpose Input/Output (GPIO) | |
Idle States | |
Instruction set extensions | Intel® SSE, Intel® SSE2, Intel® SSE3 |
Intel® Hyper-Threading technology | |
Physical Address Extensions (PAE) | 32-bit |
Thermal Monitoring |