Intel Celeron B810 processor review

Celeron B810 processor released by Intel; release date: 15 March 2011. At the time of release, the processor cost $86. The processor is designed for mobile-computers and based on Sandy Bridge microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 1.6 GHz. Maximum operating temperature - 100C. Manufacturing process technology - 32 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 2048 KB.

Supported memory types: DDR3 1066/1333. Maximum memory size: 16.6 GB.

Supported socket types: PGA988. Maximum number of processors in a configuration - 1. Power consumption (TDP): 35 Watt.

The processor has integrated graphics Intel HD Graphics with the following parameters: maximum frequency - 950 MHz.

Benchmarks

PassMark
Single thread mark

Top 1 CPU

This CPU

4870

754

PassMark
CPU mark

Top 1 CPU

This CPU

156834

775

Geekbench 4
Single Core

Top 1 CPU

This CPU

5311

308

Geekbench 4
Multi-Core

Top 1 CPU

This CPU

36691

584

Name	Value
PassMark - Single thread mark	754
PassMark - CPU mark	775
Geekbench 4 - Single Core	308
Geekbench 4 - Multi-Core	584

Specifications (specs)

Essentials
Architecture codename	Sandy Bridge
Launch date	15 March 2011
Launch price (MSRP)	$86
Place in performance rating	2907
Processor Number	B810
Series	Legacy Intel® Celeron® Processor
Status	Launched
Vertical segment	Mobile
Performance
64 bit support
Base frequency	1.60 GHz
Die size	131 mm
L1 cache	64 KB (per core)
L2 cache	256 KB (per core)
L3 cache	2048 KB
Manufacturing process technology	32 nm
Maximum core temperature	100C
Maximum frequency	1.6 GHz
Number of cores	2
Number of threads	2
Transistor count	504 million

Memory
Max memory channels	2
Maximum memory bandwidth	21.3 GB/s
Maximum memory size	16.6 GB
Supported memory types	DDR3 1066/1333
Graphics
Graphics base frequency	650 MHz
Graphics max dynamic frequency	950 MHz
Graphics max frequency	950 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported	2
SDVO
Wireless Display (WiDi) support
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	37.5mmx37.5mm (rPGA988B)
Sockets supported	PGA988
Thermal Design Power (TDP)	35 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16, 2x8, 1x8 2x4
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)