Intel Celeron B815 processor review
Celeron B815 processor released by Intel; release date: 1 November 2011. The processor is designed for mobile-computers and based on Sandy Bridge microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 1.6 GHz. Maximum operating temperature - 100 °C. Manufacturing process technology - 32 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 2048 KB.
Supported memory types: DDR3 1066/1333. Maximum memory size: 16 GB.
Supported socket types: FCPGA988. Maximum number of processors in a configuration - 1. Power consumption (TDP): 35 Watt.
The processor has integrated graphics Intel HD Graphics with the following parameters: maximum frequency - 1.05 GHz.
Benchmarks
| PassMark Single thread mark |
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| PassMark CPU mark |
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| Geekbench 4 Single Core |
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| Geekbench 4 Multi-Core |
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| Name | Value |
|---|---|
| PassMark - Single thread mark | 705 |
| PassMark - CPU mark | 731 |
| Geekbench 4 - Single Core | 283 |
| Geekbench 4 - Multi-Core | 495 |
Specifications (specs)
Essentials |
|
| Architecture codename | Sandy Bridge |
| Launch date | 1 November 2011 |
| Place in performance rating | 2959 |
| Processor Number | B815 |
| Series | Legacy Intel® Celeron® Processor |
| Status | Launched |
| Vertical segment | Mobile |
Performance |
|
| 64 bit support | |
| Base frequency | 1.60 GHz |
| Bus Speed | 5 GT/s DMI |
| Die size | 131 mm |
| L1 cache | 64 KB (per core) |
| L2 cache | 256 KB (per core) |
| L3 cache | 2048 KB |
| Manufacturing process technology | 32 nm |
| Maximum core temperature | 100 °C |
| Maximum frequency | 1.6 GHz |
| Number of cores | 2 |
| Number of threads | 2 |
| Transistor count | 504 million |
Memory |
|
| Max memory channels | 2 |
| Maximum memory bandwidth | 21.3 GB/s |
| Maximum memory size | 16 GB |
| Supported memory types | DDR3 1066/1333 |
Graphics |
|
| Graphics base frequency | 650 MHz |
| Graphics max dynamic frequency | 1.05 GHz |
| Graphics max frequency | 1.05 GHz |
| Intel® Clear Video HD technology | |
| Intel® Flexible Display Interface (Intel® FDI) | |
| Intel® InTru™ 3D technology | |
| Intel® Quick Sync Video | |
| Processor graphics | Intel HD Graphics |
Graphics interfaces |
|
| CRT | |
| DisplayPort | |
| eDP | |
| HDMI | |
| Number of displays supported | 2 |
| SDVO | |
| Wireless Display (WiDi) support | |
Compatibility |
|
| Low Halogen Options Available | |
| Max number of CPUs in a configuration | 1 |
| Package Size | 37.5mmx37.5mm (rPGA988B) |
| Sockets supported | FCPGA988 |
| Thermal Design Power (TDP) | 35 Watt |
Peripherals |
|
| Max number of PCIe lanes | 16 |
| PCI Express revision | 2.0 |
| PCIe configurations | 1x16, 2x8, 1x8 2x4 |
Security & Reliability |
|
| Anti-Theft technology | |
| Execute Disable Bit (EDB) | |
| Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
|
| 4G WiMAX Wireless | |
| Enhanced Intel SpeedStep® technology | |
| Flexible Display interface (FDI) | |
| Idle States | |
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 |
| Intel 64 | |
| Intel® AES New Instructions | |
| Intel® Demand Based Switching | |
| Intel® Fast Memory Access | |
| Intel® Flex Memory Access | |
| Intel® Hyper-Threading technology | |
| Intel® My WiFi technology | |
| Intel® Turbo Boost technology | |
| Intel® vPro™ Platform Eligibility | |
| Thermal Monitoring | |
Virtualization |
|
| Intel® Virtualization Technology (VT-x) | |
| Intel® Virtualization Technology for Directed I/O (VT-d) | |
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