Intel Celeron N2805 processor review

Celeron N2805 processor released by Intel; release date: 11 September 2013. At the time of release, the processor cost $107. The processor is designed for mobile-computers and based on Bay Trail microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 1.46 GHz. Maximum operating temperature - 80°C. Manufacturing process technology - 22 nm. Cache size: L1 - 112 KB, L2 - 1 MB.

Supported memory types: DDR3L 1066. Maximum memory size: 4 GB.

Supported socket types: FCBGA1170. Maximum number of processors in a configuration - 1. Power consumption (TDP): 4.3 Watt.

The processor has integrated graphics Intel HD Graphics with the following parameters: maximum frequency - 667 MHz.

Benchmarks

PassMark
Single thread mark

Top 1 CPU

This CPU

4863

394

PassMark
CPU mark

Top 1 CPU

This CPU

156834

335

Geekbench 4
Single Core

Top 1 CPU

This CPU

5311

752

Geekbench 4
Multi-Core

Top 1 CPU

This CPU

36691

1165

Name	Value
PassMark - Single thread mark	394
PassMark - CPU mark	335
Geekbench 4 - Single Core	752
Geekbench 4 - Multi-Core	1165

Specifications (specs)

Essentials
Architecture codename	Bay Trail
Launch date	11 September 2013
Launch price (MSRP)	$107
Place in performance rating	2820
Processor Number	N2805
Series	Intel® Celeron® Processor N Series
Status	Launched
Vertical segment	Mobile
Performance
64 bit support
Base frequency	1.46 GHz
L1 cache	112 KB
L2 cache	1 MB
Manufacturing process technology	22 nm
Maximum core temperature	80°C
Maximum frequency	1.46 GHz
Number of cores	2
Number of threads	2

Memory
Max memory channels	1
Maximum memory size	4 GB
Supported memory types	DDR3L 1066
Graphics
Graphics base frequency	313 MHz
Graphics max dynamic frequency	667 MHz
Graphics max frequency	667 MHz
Intel® Clear Video HD technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics
Graphics interfaces
Number of displays supported	2
Wireless Display (WiDi) support
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	25mm x 27mm
Scenario Design Power (SDP)	2.5 W
Sockets supported	FCBGA1170
Thermal Design Power (TDP)	4.3 Watt
Peripherals
Max number of PCIe lanes	4
Number of USB ports	5
PCI Express revision	2.0
PCIe configurations	1x4
Total number of SATA ports	2
USB revision	3.0 and 2.0
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Rapid Storage technology (RST)
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Smart Connect
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)