Intel Core 2 Duo T5670 processor review
Core 2 Duo T5670 processor released by Intel; release date: 1 March 2008. The processor is designed for mobile-computers and based on Merom microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 1.8 GHz. Maximum operating temperature - 100°C. Manufacturing process technology - 65 nm. Cache size: L2 - 2048 KB.
Power consumption (TDP): 35 Watt.
Benchmarks
PassMark Single thread mark |
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PassMark CPU mark |
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Geekbench 4 Single Core |
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Geekbench 4 Multi-Core |
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Name | Value |
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PassMark - Single thread mark | 666 |
PassMark - CPU mark | 590 |
Geekbench 4 - Single Core | 1097 |
Geekbench 4 - Multi-Core | 1713 |
Specifications (specs)
Essentials |
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Architecture codename | Merom |
Launch date | 1 March 2008 |
Place in performance rating | 2394 |
Processor Number | T5670 |
Series | Legacy Intel® Core™ Processors |
Status | Discontinued |
Vertical segment | Mobile |
Performance |
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64 bit support | |
Base frequency | 1.80 GHz |
Bus Speed | 800 MHz FSB |
Die size | 143 mm2 |
Front-side bus (FSB) | 800 MHz |
L2 cache | 2048 KB |
Manufacturing process technology | 65 nm |
Maximum core temperature | 100°C |
Maximum frequency | 1.8 GHz |
Number of cores | 2 |
Number of threads | 2 |
Transistor count | 291 million |
VID voltage range | 1.0375V-1.30V |
Compatibility |
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Low Halogen Options Available | |
Package Size | 35mm x 35mm |
Thermal Design Power (TDP) | 35 Watt |
Security & Reliability |
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Execute Disable Bit (EDB) | |
Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | |
FSB parity | |
Idle States | |
Intel 64 | |
Intel® Demand Based Switching | |
Intel® Hyper-Threading technology | |
Intel® Turbo Boost technology | |
Virtualization |
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Intel® Virtualization Technology (VT-x) |