Intel Core i3-330UM processor review

Intel Core i3-330UM

Core i3-330UM processor released by Intel; release date: 24 May 2010. The processor is designed for mobile-computers and based on Arrandale microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 2, threads - 4. Maximum CPU clock speed - 1.2 GHz. Maximum operating temperature - 105°C. Manufacturing process technology - 32 nm. Cache size: L2 - 512 KB, L3 - 3072 KB.

Supported memory types: DDR3 800. Maximum memory size: 8 GB.

Supported socket types: BGA1288. Maximum number of processors in a configuration - 1. Power consumption (TDP): 18 Watt.

The processor has integrated graphics Intel HD Graphics with the following parameters: maximum frequency - 500 MHz.

Benchmarks

PassMark
Single thread mark
Top 1 CPU
This CPU
4870
392
PassMark
CPU mark
Top 1 CPU
This CPU
156834
555
Geekbench 4
Single Core
Top 1 CPU
This CPU
5311
951
Geekbench 4
Multi-Core
Top 1 CPU
This CPU
36691
1848
Name Value
PassMark - Single thread mark 392
PassMark - CPU mark 555
Geekbench 4 - Single Core 951
Geekbench 4 - Multi-Core 1848

Specifications (specs)

Essentials

Architecture codename Arrandale
Launch date 24 May 2010
Place in performance rating 2647
Processor Number i3-330UM
Series Legacy Intel® Core™ Processors
Status Discontinued
Vertical segment Mobile

Performance

64 bit support
Base frequency 1.20 GHz
Bus Speed 2.5 GT/s DMI
Die size 81 mm2
Front-side bus (FSB) 2500 MHz
L2 cache 512 KB
L3 cache 3072 KB
Manufacturing process technology 32 nm
Maximum core temperature 105°C
Maximum frequency 1.2 GHz
Number of cores 2
Number of threads 4
Transistor count 382 million

Memory

Max memory channels 2
Maximum memory bandwidth 12.8 GB/s
Maximum memory size 8 GB
Supported memory types DDR3 800

Graphics

Graphics base frequency 166 MHz
Graphics max dynamic frequency 500 MHz
Graphics max frequency 500 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Processor graphics Intel HD Graphics

Graphics interfaces

Number of displays supported 2

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size BGA 34mm x 28mm
Sockets supported BGA1288
Thermal Design Power (TDP) 18 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1x16

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 36-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)