Intel Core i7-10700KF processor review

Intel Core i7-10700KF

Core i7-10700KF processor released by Intel; release date: 30 Apr 2020. At the time of release, the processor cost $349 - $361. The processor is designed for desktop-computers and based on Comet Lake microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 8, threads - 16. Maximum CPU clock speed - 5.10 GHz. Maximum operating temperature - 100°C. Manufacturing process technology - 14 nm. Cache size: L1 - 512 KB, L2 - 2 MB, L3 - 16 MB.

Supported memory types: DDR4-2933. Maximum memory size: 128 GB.

Supported socket types: FCLGA1200. Maximum number of processors in a configuration - 1. Power consumption (TDP): 125 Watt.

Benchmarks

PassMark
Single thread mark
Top 1 CPU
This CPU
4766
3044
PassMark
CPU mark
Top 1 CPU
This CPU
153173
18647
3DMark Fire Strike
Physics Score
Top 1 CPU
This CPU
36198
7286
CompuBench 1.5 Desktop
Ocean Surface Simulation
Top 1 CPU
This CPU
741.453 Frames/s
346.473 Frames/s
Name Value
PassMark - Single thread mark 3044
PassMark - CPU mark 18647
3DMark Fire Strike - Physics Score 7286
CompuBench 1.5 Desktop - Ocean Surface Simulation 346.473 Frames/s

Specifications (specs)

Essentials

Architecture codename Comet Lake
Launch date 30 Apr 2020
Launch price (MSRP) $349 - $361
Place in performance rating 571
Processor Number i7-10700KF
Series 10th Generation Intel Core i7 Processors
Status Launched
Vertical segment Desktop

Performance

64 bit support
Base frequency 3.80 GHz
Bus Speed 8 GT/s
L1 cache 512 KB
L2 cache 2 MB
L3 cache 16 MB
Manufacturing process technology 14 nm
Maximum core temperature 100°C
Maximum frequency 5.10 GHz
Number of cores 8
Number of threads 16

Memory

Max memory channels 2
Maximum memory bandwidth 45.8 GB/s
Maximum memory size 128 GB
Supported memory types DDR4-2933

Compatibility

Configurable TDP-down 95 Watt
Configurable TDP-down Frequency 3.50 GHz
Max number of CPUs in a configuration 1
Package Size 37.5mm x 37.5mm
Sockets supported FCLGA1200
Thermal Design Power (TDP) 125 Watt
Thermal Solution PCG 2015D

Peripherals

Max number of PCIe lanes 16
PCI Express revision 3.0
PCIe configurations Up to 1x16, 2x8, 1x8+2x4
Scalability 1S Only

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel SSE4.1, Intel SSE4.2, Intel AVX2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® Stable Image Platform Program (SIPP)
Intel® Thermal Velocity Boost
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)