Intel Core i7-660UM processor review

Core i7-660UM processor released by Intel; release date: 1 September 2010. The processor is designed for mobile-computers and based on Arrandale microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 2, threads - 4. Maximum CPU clock speed - 2.40 GHz. Maximum operating temperature - 105°C. Manufacturing process technology - 32 nm. Cache size: L2 - 512 KB, L3 - 4096 KB.

Supported memory types: DDR3 800. Maximum memory size: 8 GB.

Supported socket types: BGA1288. Maximum number of processors in a configuration - 1. Power consumption (TDP): 18 Watt.

The processor has integrated graphics Intel HD Graphics with the following parameters: maximum frequency - 500 MHz.

Benchmarks

PassMark
Single thread mark

Top 1 CPU

This CPU

4870

925

PassMark
CPU mark

Top 1 CPU

This CPU

156834

1284

Name	Value
PassMark - Single thread mark	925
PassMark - CPU mark	1284

Specifications (specs)

Essentials
Architecture codename	Arrandale
Launch date	1 September 2010
Place in performance rating	2377
Processor Number	i7-660UM
Series	Legacy Intel® Core™ Processors
Status	Discontinued
Vertical segment	Mobile
Performance
64 bit support
Base frequency	1.33 GHz
Bus Speed	2.5 GT/s DMI
Die size	81 mm2
Front-side bus (FSB)	2500 MHz
L2 cache	512 KB
L3 cache	4096 KB
Manufacturing process technology	32 nm
Maximum core temperature	105°C
Maximum frequency	2.40 GHz
Number of cores	2
Number of threads	4
Transistor count	382 million

Memory
Max memory channels	2
Maximum memory bandwidth	12.8 GB/s
Maximum memory size	8 GB
Supported memory types	DDR3 800
Graphics
Graphics base frequency	166 MHz
Graphics max dynamic frequency	500 MHz
Graphics max frequency	500 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Processor graphics	Intel HD Graphics
Graphics interfaces
Number of displays supported	2
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	BGA 34mm x 28mm
Sockets supported	BGA1288
Thermal Design Power (TDP)	18 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)	36-bit
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)