Intel Core i7-7740X processor review
Core i7-7740X processor released by Intel; release date: 30 May 2017. At the time of release, the processor cost $350. The processor is designed for desktop-computers and based on Kaby Lake microarchitecture.
CPU is unlocked for overclocking. Total number of cores - 4, threads - 8. Maximum CPU clock speed - 4.50 GHz. Maximum operating temperature - 100°C. Manufacturing process technology - 14 nm. Cache size: L1 - 256 KB, L2 - 1 MB, L3 - 8 MB.
Supported memory types: DDR4-2666. Maximum memory size: 64 GB.
Supported socket types: FCLGA2066. Maximum number of processors in a configuration - 1. Power consumption (TDP): 112 Watt.
Benchmarks
| PassMark Single thread mark |
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| PassMark CPU mark |
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| Geekbench 4 Single Core |
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| Geekbench 4 Multi-Core |
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| 3DMark Fire Strike Physics Score |
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| Name | Value |
|---|---|
| PassMark - Single thread mark | 2696 |
| PassMark - CPU mark | 9630 |
| Geekbench 4 - Single Core | 1251 |
| Geekbench 4 - Multi-Core | 4898 |
| 3DMark Fire Strike - Physics Score | 0 |
Specifications (specs)
Essentials |
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| Architecture codename | Kaby Lake |
| Launch date | 30 May 2017 |
| Launch price (MSRP) | $350 |
| Place in performance rating | 1440 |
| Price now | $348.99 |
| Processor Number | i7-7740X |
| Series | Intel® Core™ X-series Processors |
| Status | Discontinued |
| Value for money (0-100) | 10.34 |
| Vertical segment | Desktop |
Performance |
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| 64 bit support | |
| Base frequency | 4.30 GHz |
| Bus Speed | 8 GT/s DMI3 |
| L1 cache | 256 KB |
| L2 cache | 1 MB |
| L3 cache | 8 MB |
| Manufacturing process technology | 14 nm |
| Maximum case temperature (TCase) | 72 °C |
| Maximum core temperature | 100°C |
| Maximum frequency | 4.50 GHz |
| Number of cores | 4 |
| Number of QPI Links | 0 |
| Number of threads | 8 |
| Unlocked | |
Memory |
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| Max memory channels | 2 |
| Maximum memory size | 64 GB |
| Supported memory types | DDR4-2666 |
Compatibility |
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| Low Halogen Options Available | |
| Max number of CPUs in a configuration | 1 |
| Sockets supported | FCLGA2066 |
| Thermal Design Power (TDP) | 112 Watt |
| Thermal Solution | PCG 2017X |
Peripherals |
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| Max number of PCIe lanes | 16 |
| PCI Express revision | 3.0 |
| PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 |
| Scalability | 1S Only |
Security & Reliability |
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| Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
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| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
| Intel 64 | |
| Intel® Advanced Vector Extensions (AVX) | |
| Intel® AES New Instructions | |
| Intel® Hyper-Threading technology | |
| Intel® Optane™ Memory Supported | |
| Intel® Turbo Boost technology | |
| Intel® vPro™ Platform Eligibility | |
Virtualization |
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| AMD Virtualization (AMD-V™) | |
| Intel® Virtualization Technology (VT-x) | |
| Intel® Virtualization Technology for Directed I/O (VT-d) | |
