Intel Pentium 997 processor review

Pentium 997 processor released by Intel; release date: 1 October 2012. At the time of release, the processor cost $134. The processor is designed for mobile-computers and based on Sandy Bridge microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 1.6 GHz. Maximum operating temperature - 100 °C. Manufacturing process technology - 32 nm. Cache size: L1 - 128 KB, L2 - 512 KB, L3 - 2 MB.

Supported memory types: DDR3 1066/1333. Maximum memory size: 16 GB.

Supported socket types: FCBGA1023. Maximum number of processors in a configuration - 1. Power consumption (TDP): 17 Watt.

The processor has integrated graphics Intel HD Graphics with the following parameters: maximum frequency - 1 GHz.

Benchmarks

PassMark
Single thread mark

Top 1 CPU

This CPU

4870

746

PassMark
CPU mark

Top 1 CPU

This CPU

156834

809

Geekbench 4
Single Core

Top 1 CPU

This CPU

5311

287

Geekbench 4
Multi-Core

Top 1 CPU

This CPU

36691

501

Name	Value
PassMark - Single thread mark	746
PassMark - CPU mark	809
Geekbench 4 - Single Core	287
Geekbench 4 - Multi-Core	501

Specifications (specs)

Essentials
Architecture codename	Sandy Bridge
Launch date	1 October 2012
Launch price (MSRP)	$134
Place in performance rating	2917
Processor Number	997
Series	Legacy Intel® Pentium® Processor
Status	Launched
Vertical segment	Mobile
Performance
64 bit support
Base frequency	1.60 GHz
Bus Speed	5 GT/s DMI
Die size	131 mm
L1 cache	128 KB
L2 cache	512 KB
L3 cache	2 MB
Manufacturing process technology	32 nm
Maximum core temperature	100 °C
Maximum frequency	1.6 GHz
Number of cores	2
Number of threads	2
Transistor count	504 million

Memory
Max memory channels	2
Maximum memory bandwidth	21.3 GB/s
Maximum memory size	16 GB
Supported memory types	DDR3 1066/1333
Graphics
Graphics base frequency	350 MHz
Graphics max dynamic frequency	1.00 GHz
Graphics max frequency	1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported	2
SDVO
Wireless Display (WiDi) support
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	31.0mm x 24.0mm (BGA1023)
Sockets supported	FCBGA1023
Thermal Design Power (TDP)	17 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16, 2x8, 1x8 2x4
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)