Intel Pentium G2100T processor review
Pentium G2100T processor released by Intel; release date: September 2012. The processor is designed for desktop-computers and based on Ivy Bridge microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 2.6 GHz. Manufacturing process technology - 22 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 3072 KB (shared).
Supported memory types: DDR3 1333/1600. Maximum memory size: 32 GB.
Supported socket types: FCLGA1155. Maximum number of processors in a configuration - 1. Power consumption (TDP): 35 Watt.
The processor has integrated graphics Intel HD Graphics with the following parameters: maximum frequency - 1.05 GHz.
Benchmarks
PassMark Single thread mark |
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PassMark CPU mark |
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Name | Value |
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PassMark - Single thread mark | 1460 |
PassMark - CPU mark | 1691 |
Specifications (specs)
Essentials |
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Architecture codename | Ivy Bridge |
Launch date | September 2012 |
Place in performance rating | 1775 |
Processor Number | G2100T |
Series | Intel® Pentium® Processor G Series |
Status | Discontinued |
Vertical segment | Desktop |
Performance |
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64 bit support | |
Base frequency | 2.60 GHz |
Bus Speed | 5 GT/s DMI |
Die size | 94 mm |
L1 cache | 64 KB (per core) |
L2 cache | 256 KB (per core) |
L3 cache | 3072 KB (shared) |
Manufacturing process technology | 22 nm |
Maximum case temperature (TCase) | 65 °C |
Maximum frequency | 2.6 GHz |
Number of cores | 2 |
Number of threads | 2 |
Memory |
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ECC memory support | |
Max memory channels | 2 |
Maximum memory bandwidth | 25.6 GB/s |
Maximum memory size | 32 GB |
Supported memory types | DDR3 1333/1600 |
Graphics |
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Graphics base frequency | 650 MHz |
Graphics max dynamic frequency | 1.05 GHz |
Graphics max frequency | 1.05 GHz |
Intel® Clear Video HD technology | |
Intel® InTru™ 3D technology | |
Intel® Quick Sync Video | |
Processor graphics | Intel HD Graphics |
Graphics interfaces |
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Number of displays supported | 3 |
Wireless Display (WiDi) support | |
Compatibility |
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Low Halogen Options Available | |
Max number of CPUs in a configuration | 1 |
Package Size | 37.5mm x 37.5mm |
Sockets supported | FCLGA1155 |
Thermal Design Power (TDP) | 35 Watt |
Thermal Solution | 2011A |
Peripherals |
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PCI Express revision | 2.0 |
PCIe configurations | up to 1x16, 2x8, 1x8 & 2x4 |
Security & Reliability |
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Anti-Theft technology | |
Execute Disable Bit (EDB) | |
Intel® Secure Key technology | |
Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | |
Idle States | |
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 |
Intel 64 | |
Intel® AES New Instructions | |
Intel® Hyper-Threading technology | |
Intel® My WiFi technology | |
Intel® Optane™ Memory Supported | |
Intel® Turbo Boost technology | |
Intel® vPro™ Platform Eligibility | |
Thermal Monitoring | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | |
Intel® Virtualization Technology for Directed I/O (VT-d) | |
Intel® VT-x with Extended Page Tables (EPT) |