Intel Pentium G645T processor review

Pentium G645T processor released by Intel; release date: September 2012. The processor is designed for desktop-computers and based on Sandy Bridge microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 2.5 GHz. Maximum operating temperature - 65.0°C. Manufacturing process technology - 32 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 3072 KB (shared).

Supported memory types: DDR3 1066. Maximum memory size: 32 GB.

Supported socket types: FCLGA1155. Maximum number of processors in a configuration - 1. Power consumption (TDP): 35 Watt.

The processor has integrated graphics Intel HD Graphics with the following parameters: maximum frequency - 1.1 GHz.

Benchmarks

PassMark
Single thread mark

Top 1 CPU

This CPU

4870

1131

PassMark
CPU mark

Top 1 CPU

This CPU

156834

1228

Geekbench 4
Single Core

Top 1 CPU

This CPU

5311

452

Geekbench 4
Multi-Core

Top 1 CPU

This CPU

36691

848

Name	Value
PassMark - Single thread mark	1131
PassMark - CPU mark	1228
Geekbench 4 - Single Core	452
Geekbench 4 - Multi-Core	848

Specifications (specs)

Essentials
Architecture codename	Sandy Bridge
Launch date	September 2012
Place in performance rating	2534
Processor Number	G645T
Series	Legacy Intel® Pentium® Processor
Status	Discontinued
Vertical segment	Desktop
Performance
64 bit support
Base frequency	2.50 GHz
Bus Speed	5 GT/s DMI
Die size	131 mm
L1 cache	64 KB (per core)
L2 cache	256 KB (per core)
L3 cache	3072 KB (shared)
Manufacturing process technology	32 nm
Maximum core temperature	65.0°C
Maximum frequency	2.5 GHz
Number of cores	2
Number of threads	2
Transistor count	504 million

Memory
Max memory channels	2
Maximum memory bandwidth	17 GB/s
Maximum memory size	32 GB
Supported memory types	DDR3 1066
Graphics
Graphics base frequency	650 MHz
Graphics max dynamic frequency	1.10 GHz
Graphics max frequency	1.1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics
Graphics interfaces
Number of displays supported	2
Wireless Display (WiDi) support
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	37.5mm x 37.5mm
Sockets supported	FCLGA1155
Thermal Design Power (TDP)	35 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)