Intel Pentium P6300 processor review

Pentium P6300 processor released by Intel; release date: 6 January 2011. The processor is designed for mobile-computers and based on Arrandale microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 2.27 GHz. Maximum operating temperature - 90°C. Manufacturing process technology - 32 nm. Cache size: L1 - 128 KB, L2 - 512 KB, L3 - 3072 KB.

Supported memory types: DDR3 800/1066. Maximum memory size: 8 GB.

Supported socket types: PGA988. Maximum number of processors in a configuration - 1. Power consumption (TDP): 35 Watt.

The processor has integrated graphics Intel HD Graphics with the following parameters: maximum frequency - 667 MHz.

Benchmarks

PassMark
Single thread mark

Top 1 CPU

This CPU

4870

772

PassMark
CPU mark

Top 1 CPU

This CPU

156834

834

Geekbench 4
Single Core

Top 1 CPU

This CPU

5311

1495

Geekbench 4
Multi-Core

Top 1 CPU

This CPU

36691

2614

Name	Value
PassMark - Single thread mark	772
PassMark - CPU mark	834
Geekbench 4 - Single Core	1495
Geekbench 4 - Multi-Core	2614

Specifications (specs)

Essentials
Architecture codename	Arrandale
Launch date	6 January 2011
Place in performance rating	2055
Processor Number	P6300
Series	Legacy Intel® Pentium® Processor
Status	Discontinued
Vertical segment	Mobile
Performance
64 bit support
Base frequency	2.27 GHz
Bus Speed	2.5 GT/s DMI
Die size	81 mm2
Front-side bus (FSB)	2500 MHz
L1 cache	128 KB
L2 cache	512 KB
L3 cache	3072 KB
Manufacturing process technology	32 nm
Maximum core temperature	90°C
Maximum frequency	2.27 GHz
Number of cores	2
Number of threads	2
Transistor count	382 million

Memory
Max memory channels	2
Maximum memory bandwidth	17.1 GB/s
Maximum memory size	8 GB
Supported memory types	DDR3 800/1066
Graphics
Graphics base frequency	500 MHz
Graphics max dynamic frequency	667 MHz
Graphics max frequency	667 MHz
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Processor graphics	Intel HD Graphics
Graphics interfaces
Number of displays supported	2
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	37.5mmx37.5mm
Sockets supported	PGA988
Thermal Design Power (TDP)	35 Watt
Peripherals
Max number of PCIe lanes	1
PCI Express revision	2.0
PCIe configurations	1x16
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)	36-bit
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)