Intel Xeon E3-1241 v3 processor review
Xeon E3-1241 v3 processor released by Intel; release date: Q2'14. The processor is designed for server-computers and based on Haswell microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 4, threads - 8. Maximum CPU clock speed - 3.90 GHz. Manufacturing process technology - 22 nm.
Supported memory types: DDR3 and DDR3L 1333/1600 at 1.5V. Maximum memory size: 32 GB.
Supported socket types: FCLGA1150. Maximum number of processors in a configuration - 1. Power consumption (TDP): 80 Watt.
Benchmarks
PassMark Single thread mark |
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PassMark CPU mark |
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Geekbench 4 Single Core |
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Geekbench 4 Multi-Core |
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CompuBench 1.5 Desktop Face Detection |
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CompuBench 1.5 Desktop Ocean Surface Simulation |
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CompuBench 1.5 Desktop T-Rex |
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CompuBench 1.5 Desktop Video Composition |
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CompuBench 1.5 Desktop Bitcoin Mining |
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Name | Value |
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PassMark - Single thread mark | 2172 |
PassMark - CPU mark | 7144 |
Geekbench 4 - Single Core | 919 |
Geekbench 4 - Multi-Core | 3419 |
CompuBench 1.5 Desktop - Face Detection | 5.288 mPixels/s |
CompuBench 1.5 Desktop - Ocean Surface Simulation | 90.177 Frames/s |
CompuBench 1.5 Desktop - T-Rex | 0.666 Frames/s |
CompuBench 1.5 Desktop - Video Composition | 2.528 Frames/s |
CompuBench 1.5 Desktop - Bitcoin Mining | 6.201 mHash/s |
Specifications (specs)
Essentials |
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Architecture codename | Haswell |
Launch date | Q2'14 |
Place in performance rating | 2045 |
Processor Number | E3-1241V3 |
Series | Intel® Xeon® Processor E3 v3 Family |
Status | Launched |
Vertical segment | Server |
Performance |
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64 bit support | |
Base frequency | 3.50 GHz |
Bus Speed | 5 GT/s DMI2 |
Manufacturing process technology | 22 nm |
Maximum frequency | 3.90 GHz |
Number of cores | 4 |
Number of QPI Links | 0 |
Number of threads | 8 |
Memory |
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Max memory channels | 2 |
Maximum memory bandwidth | 25.6 GB/s |
Maximum memory size | 32 GB |
Supported memory types | DDR3 and DDR3L 1333/1600 at 1.5V |
Compatibility |
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Low Halogen Options Available | |
Max number of CPUs in a configuration | 1 |
Package Size | 37.5mm x 37.5mm |
Sockets supported | FCLGA1150 |
Thermal Design Power (TDP) | 80 Watt |
Thermal Solution | PCG 2013D |
Peripherals |
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Max number of PCIe lanes | 16 |
PCI Express revision | 3.0 |
PCIe configurations | 1x16, 2x8, 1x8/2x4 |
Scalability | 1S Only |
Security & Reliability |
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Anti-Theft technology | |
Execute Disable Bit (EDB) | |
Intel® Identity Protection technology | |
Intel® OS Guard | |
Intel® Secure Key technology | |
Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | |
Idle States | |
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 | |
Intel® AES New Instructions | |
Intel® Fast Memory Access | |
Intel® Flex Memory Access | |
Intel® Hyper-Threading technology | |
Intel® Stable Image Platform Program (SIPP) | |
Intel® TSX-NI | |
Intel® Turbo Boost technology | |
Intel® vPro™ Platform Eligibility | |
Thermal Monitoring | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | |
Intel® Virtualization Technology for Directed I/O (VT-d) | |
Intel® VT-x with Extended Page Tables (EPT) |