Intel Xeon E3-1280 v2 processor review
Xeon E3-1280 v2 processor released by Intel; release date: May 2012. At the time of release, the processor cost $645. The processor is designed for server-computers and based on Ivy Bridge microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 4, threads - 8. Maximum CPU clock speed - 4.00 GHz. Manufacturing process technology - 22 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 8192 KB (shared).
Supported memory types: DDR3 1333/1600. Maximum memory size: 32.77 GB.
Supported socket types: FCLGA1155. Maximum number of processors in a configuration - 1. Power consumption (TDP): 69 Watt.
Benchmarks
PassMark Single thread mark |
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PassMark CPU mark |
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Geekbench 4 Single Core |
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Geekbench 4 Multi-Core |
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CompuBench 1.5 Desktop Face Detection |
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Name | Value |
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PassMark - Single thread mark | 2164 |
PassMark - CPU mark | 6564 |
Geekbench 4 - Single Core | 852 |
Geekbench 4 - Multi-Core | 3205 |
CompuBench 1.5 Desktop - Face Detection | 7.106 mPixels/s |
Specifications (specs)
Essentials |
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Architecture codename | Ivy Bridge |
Launch date | May 2012 |
Launch price (MSRP) | $645 |
Place in performance rating | 1717 |
Price now | $1,512.82 |
Processor Number | E3-1280V2 |
Series | Intel® Xeon® Processor E3 v2 Family |
Status | Discontinued |
Value for money (0-100) | 1.84 |
Vertical segment | Server |
Performance |
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64 bit support | |
Base frequency | 3.60 GHz |
Bus Speed | 5 GT/s DMI |
Die size | 160 mm |
L1 cache | 64 KB (per core) |
L2 cache | 256 KB (per core) |
L3 cache | 8192 KB (shared) |
Manufacturing process technology | 22 nm |
Maximum frequency | 4.00 GHz |
Number of cores | 4 |
Number of threads | 8 |
Transistor count | 1400 million |
Memory |
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ECC memory support | |
Max memory channels | 2 |
Maximum memory bandwidth | 25.6 GB/s |
Maximum memory size | 32.77 GB |
Supported memory types | DDR3 1333/1600 |
Compatibility |
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Low Halogen Options Available | |
Max number of CPUs in a configuration | 1 |
Package Size | 37.5mm x 37.5mm |
Sockets supported | FCLGA1155 |
Thermal Design Power (TDP) | 69 Watt |
Peripherals |
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PCI Express revision | 3.0 |
PCIe configurations | 1x16 & 1x4, 2x8 & 1x4 or 1x8 & 3x4 |
Security & Reliability |
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Execute Disable Bit (EDB) | |
Intel® Identity Protection technology | |
Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | |
Idle States | |
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX |
Intel 64 | |
Intel® Advanced Vector Extensions (AVX) | |
Intel® AES New Instructions | |
Intel® Demand Based Switching | |
Intel® Fast Memory Access | |
Intel® Flex Memory Access | |
Intel® Hyper-Threading technology | |
Intel® TSX-NI | |
Intel® Turbo Boost technology | |
Intel® vPro™ Platform Eligibility | |
Thermal Monitoring | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | |
Intel® Virtualization Technology for Directed I/O (VT-d) | |
Intel® VT-x with Extended Page Tables (EPT) |