Intel Xeon E3-1280 v3 processor review

Xeon E3-1280 v3 processor released by Intel; release date: June 2013. At the time of release, the processor cost $800. The processor is designed for server-computers and based on Haswell microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 4, threads - 8. Maximum CPU clock speed - 4.00 GHz. Manufacturing process technology - 22 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 8192 KB (shared).

Supported memory types: DDR3 and DDR3L 1333/1600 at 1.5V. Maximum memory size: 32 GB.

Supported socket types: FCLGA1150. Maximum number of processors in a configuration - 1. Power consumption (TDP): 82 Watt.

The processor has integrated graphics None.

Benchmarks

PassMark
Single thread mark

Top 1 CPU

This CPU

4870

2265

PassMark
CPU mark

Top 1 CPU

This CPU

156834

7390

Geekbench 4
Single Core

Top 1 CPU

This CPU

5311

4056

Geekbench 4
Multi-Core

Top 1 CPU

This CPU

36691

13102

Name	Value
PassMark - Single thread mark	2265
PassMark - CPU mark	7390
Geekbench 4 - Single Core	4056
Geekbench 4 - Multi-Core	13102

Specifications (specs)

Essentials
Architecture codename	Haswell
Launch date	June 2013
Launch price (MSRP)	$800
Place in performance rating	432
Price now	$697.36
Processor Number	E3-1280 v3
Series	Intel® Xeon® Processor E3 v3 Family
Status	Discontinued
Value for money (0-100)	4.12
Vertical segment	Server
Performance
64 bit support
Base frequency	3.60 GHz
Bus Speed	5 GT/s DMI
Die size	160 mm
L1 cache	64 KB (per core)
L2 cache	256 KB (per core)
L3 cache	8192 KB (shared)
Manufacturing process technology	22 nm
Maximum frequency	4.00 GHz
Number of cores	4
Number of QPI Links	0
Number of threads	8
Transistor count	1400 million

Memory
ECC memory support
Max memory channels	2
Maximum memory bandwidth	25.6 GB/s
Maximum memory size	32 GB
Supported memory types	DDR3 and DDR3L 1333/1600 at 1.5V
Graphics
Processor graphics	None
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	37.5mm x 37.5mm
Sockets supported	FCLGA1150
Thermal Design Power (TDP)	82 Watt
Thermal Solution	PCG 2013D
Peripherals
Max number of PCIe lanes	16
PCI Express revision	3.0
PCIe configurations	1x16, 2x8, 1x8/2x4
Scalability	1S Only
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)