Intel Xeon E5-2630 v2 processor review
Xeon E5-2630 v2 processor released by Intel; release date: September 2013. At the time of release, the processor cost $250. The processor is designed for server-computers and based on Ivy Bridge EP microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 6, threads - 12. Maximum CPU clock speed - 3.10 GHz. Maximum operating temperature - 71°C. Manufacturing process technology - 22 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 15360 KB (shared).
Supported memory types: DDR3 800/1066/1333/1600. Maximum memory size: 768 GB.
Supported socket types: FCLGA2011. Maximum number of processors in a configuration - 2. Power consumption (TDP): 80 Watt.
Benchmarks
PassMark Single thread mark |
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PassMark CPU mark |
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Geekbench 4 Single Core |
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Geekbench 4 Multi-Core |
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Name | Value |
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PassMark - Single thread mark | 1572 |
PassMark - CPU mark | 13629 |
Geekbench 4 - Single Core | 599 |
Geekbench 4 - Multi-Core | 3580 |
Specifications (specs)
Essentials |
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Architecture codename | Ivy Bridge EP |
Launch date | September 2013 |
Launch price (MSRP) | $250 |
Place in performance rating | 1772 |
Price now | $62.98 |
Processor Number | E5-2630V2 |
Series | Intel® Xeon® Processor E5 v2 Family |
Status | Launched |
Value for money (0-100) | 48.64 |
Vertical segment | Server |
Performance |
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64 bit support | |
Base frequency | 2.60 GHz |
Bus Speed | 7.2 GT/s QPI |
Die size | 160 mm |
L1 cache | 64 KB (per core) |
L2 cache | 256 KB (per core) |
L3 cache | 15360 KB (shared) |
Manufacturing process technology | 22 nm |
Maximum core temperature | 71°C |
Maximum frequency | 3.10 GHz |
Number of cores | 6 |
Number of QPI Links | 2 |
Number of threads | 12 |
Transistor count | 1400 million |
VID voltage range | 0.65–1.30V |
Memory |
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ECC memory support | |
Max memory channels | 4 |
Maximum memory bandwidth | 51.2 GB/s |
Maximum memory size | 768 GB |
Supported memory types | DDR3 800/1066/1333/1600 |
Compatibility |
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Low Halogen Options Available | |
Max number of CPUs in a configuration | 2 |
Package Size | 52.5mm x 45mm |
Sockets supported | FCLGA2011 |
Thermal Design Power (TDP) | 80 Watt |
Peripherals |
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Max number of PCIe lanes | 40 |
PCI Express revision | 3.0 |
PCIe configurations | x4, x8, x16 |
Scalability | 2S Only |
Security & Reliability |
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Execute Disable Bit (EDB) | |
Intel® Identity Protection technology | |
Intel® OS Guard | |
Intel® Secure Key technology | |
Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | |
Idle States | |
Instruction set extensions | Intel® AVX |
Intel 64 | |
Intel® Advanced Vector Extensions (AVX) | |
Intel® AES New Instructions | |
Intel® Demand Based Switching | |
Intel® Flex Memory Access | |
Intel® Hyper-Threading technology | |
Intel® TSX-NI | |
Intel® Turbo Boost technology | |
Intel® vPro™ Platform Eligibility | |
Physical Address Extensions (PAE) | 46-bit |
Thermal Monitoring | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | |
Intel® Virtualization Technology for Directed I/O (VT-d) | |
Intel® VT-x with Extended Page Tables (EPT) |