Intel Xeon E5-2640 v2 processor review
Xeon E5-2640 v2 processor released by Intel; release date: September 2013. At the time of release, the processor cost $728. The processor is designed for server-computers and based on Ivy Bridge EP microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 8, threads - 16. Maximum CPU clock speed - 2.50 GHz. Maximum operating temperature - 75°C. Manufacturing process technology - 22 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 20480 KB (shared).
Supported memory types: DDR3 800/1066/1333/1600. Maximum memory size: 768 GB.
Supported socket types: FCLGA2011. Maximum number of processors in a configuration - 2. Power consumption (TDP): 95 Watt.
Benchmarks
| PassMark Single thread mark |
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| PassMark CPU mark |
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| Geekbench 4 Single Core |
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| Geekbench 4 Multi-Core |
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| Name | Value |
|---|---|
| PassMark - Single thread mark | 1184 |
| PassMark - CPU mark | 13421 |
| Geekbench 4 - Single Core | 453 |
| Geekbench 4 - Multi-Core | 3997 |
Specifications (specs)
Essentials |
|
| Architecture codename | Ivy Bridge EP |
| Launch date | September 2013 |
| Launch price (MSRP) | $728 |
| Place in performance rating | 1954 |
| Price now | $96.34 |
| Processor Number | E5-2640V2 |
| Series | Intel® Xeon® Processor E5 v2 Family |
| Status | Launched |
| Value for money (0-100) | 30.28 |
| Vertical segment | Server |
Performance |
|
| 64 bit support | |
| Base frequency | 2.00 GHz |
| Bus Speed | 7.2 GT/s QPI |
| Die size | 160 mm |
| L1 cache | 64 KB (per core) |
| L2 cache | 256 KB (per core) |
| L3 cache | 20480 KB (shared) |
| Manufacturing process technology | 22 nm |
| Maximum core temperature | 75°C |
| Maximum frequency | 2.50 GHz |
| Number of cores | 8 |
| Number of QPI Links | 2 |
| Number of threads | 16 |
| Transistor count | 1400 million |
| VID voltage range | 0.65–1.30V |
Memory |
|
| ECC memory support | |
| Max memory channels | 4 |
| Maximum memory bandwidth | 51.2 GB/s |
| Maximum memory size | 768 GB |
| Supported memory types | DDR3 800/1066/1333/1600 |
Compatibility |
|
| Low Halogen Options Available | |
| Max number of CPUs in a configuration | 2 |
| Package Size | 52.5mm x 51mm |
| Sockets supported | FCLGA2011 |
| Thermal Design Power (TDP) | 95 Watt |
Peripherals |
|
| Max number of PCIe lanes | 40 |
| PCI Express revision | 3.0 |
| PCIe configurations | x4, x8, x16 |
| Scalability | 2S Only |
Security & Reliability |
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| Execute Disable Bit (EDB) | |
| Intel® Identity Protection technology | |
| Intel® OS Guard | |
| Intel® Secure Key technology | |
| Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | |
| Idle States | |
| Instruction set extensions | Intel® AVX |
| Intel 64 | |
| Intel® Advanced Vector Extensions (AVX) | |
| Intel® AES New Instructions | |
| Intel® Demand Based Switching | |
| Intel® Flex Memory Access | |
| Intel® Hyper-Threading technology | |
| Intel® TSX-NI | |
| Intel® Turbo Boost technology | |
| Intel® vPro™ Platform Eligibility | |
| Physical Address Extensions (PAE) | 46-bit |
| Thermal Monitoring | |
Virtualization |
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| Intel® Virtualization Technology (VT-x) | |
| Intel® Virtualization Technology for Directed I/O (VT-d) | |
| Intel® VT-x with Extended Page Tables (EPT) | |
Navigation
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