Intel Xeon E5-2650 processor review

Intel Xeon E5-2650

Xeon E5-2650 processor released by Intel; release date: March 2012. At the time of release, the processor cost $91. The processor is designed for server-computers and based on Sandy Bridge EP microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 8, threads - 16. Maximum CPU clock speed - 2.80 GHz. Maximum operating temperature - 77.4°C. Manufacturing process technology - 32 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 20480 KB (shared).

Supported memory types: DDR3 800/1066/1333/1600. Maximum memory size: 384 GB.

Supported socket types: FCLGA2011. Maximum number of processors in a configuration - 2. Power consumption (TDP): 95 Watt.

Benchmarks

PassMark
Single thread mark
Top 1 CPU
This CPU
4870
1248
PassMark
CPU mark
Top 1 CPU
This CPU
156834
12897
Geekbench 4
Single Core
Top 1 CPU
This CPU
5311
471
Geekbench 4
Multi-Core
Top 1 CPU
This CPU
36691
3527
Name Value
PassMark - Single thread mark 1248
PassMark - CPU mark 12897
Geekbench 4 - Single Core 471
Geekbench 4 - Multi-Core 3527

Specifications (specs)

Essentials

Architecture codename Sandy Bridge EP
Launch date March 2012
Launch price (MSRP) $91
Place in performance rating 2025
Price now $130.43
Processor Number E5-2650
Series Intel® Xeon® Processor E5 Family
Status Discontinued
Value for money (0-100) 22.91
Vertical segment Server

Performance

64 bit support
Base frequency 2.00 GHz
Bus Speed 8 GT/s QPI
Die size 435 mm
L1 cache 64 KB (per core)
L2 cache 256 KB (per core)
L3 cache 20480 KB (shared)
Manufacturing process technology 32 nm
Maximum core temperature 77.4°C
Maximum frequency 2.80 GHz
Number of cores 8
Number of QPI Links 2
Number of threads 16
Transistor count 2270 million
VID voltage range 0.60V-1.35V

Memory

ECC memory support
Max memory channels 4
Maximum memory bandwidth 51.2 GB/s
Maximum memory size 384 GB
Supported memory types DDR3 800/1066/1333/1600

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 2
Package Size 52.5mm x 45.0mm
Sockets supported FCLGA2011
Thermal Design Power (TDP) 95 Watt

Peripherals

Max number of PCIe lanes 40
PCI Express revision 3.0
Scalability 2S Only

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)