Intel Xeon E5-2660 v2 processor review

Xeon E5-2660 v2 processor released by Intel; release date: September 2013. At the time of release, the processor cost $850. The processor is designed for server-computers and based on Ivy Bridge EP microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 10, threads - 20. Maximum CPU clock speed - 3.00 GHz. Maximum operating temperature - 75°C. Manufacturing process technology - 22 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 25600 KB (shared).

Supported memory types: DDR3 800/1066/1333/1600/1866. Maximum memory size: 768 GB.

Supported socket types: FCLGA2011. Maximum number of processors in a configuration - 2. Power consumption (TDP): 95 Watt.

Benchmarks

PassMark
Single thread mark

Top 1 CPU

This CPU

4870

1423

PassMark
CPU mark

Top 1 CPU

This CPU

156834

18491

Geekbench 4
Single Core

Top 1 CPU

This CPU

5311

605

Geekbench 4
Multi-Core

Top 1 CPU

This CPU

36691

5451

Name	Value
PassMark - Single thread mark	1423
PassMark - CPU mark	18491
Geekbench 4 - Single Core	605
Geekbench 4 - Multi-Core	5451

Specifications (specs)

Essentials
Architecture codename	Ivy Bridge EP
Launch date	September 2013
Launch price (MSRP)	$850
Place in performance rating	1650
Price now	$275.51
Processor Number	E5-2660V2
Series	Intel® Xeon® Processor E5 v2 Family
Status	Launched
Value for money (0-100)	14.39
Vertical segment	Server
Performance
64 bit support
Base frequency	2.20 GHz
Bus Speed	8 GT/s QPI
Die size	160 mm
L1 cache	64 KB (per core)
L2 cache	256 KB (per core)
L3 cache	25600 KB (shared)
Manufacturing process technology	22 nm
Maximum core temperature	75°C
Maximum frequency	3.00 GHz
Number of cores	10
Number of QPI Links	2
Number of threads	20
Transistor count	1400 million
VID voltage range	0.65–1.30V

Memory
ECC memory support
Max memory channels	4
Maximum memory bandwidth	59.7 GB/s
Maximum memory size	768 GB
Supported memory types	DDR3 800/1066/1333/1600/1866
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	2
Package Size	52.5mm x 45mm
Sockets supported	FCLGA2011
Thermal Design Power (TDP)	95 Watt
Peripherals
Max number of PCIe lanes	40
PCI Express revision	3.0
PCIe configurations	x4, x8, x16
Scalability	2S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)	46-bit
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)