Intel Xeon E5-2667 processor review

Xeon E5-2667 processor released by Intel; release date: March 2012. At the time of release, the processor cost $714. The processor is designed for server-computers and based on Sandy Bridge EP microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 6, threads - 12. Maximum CPU clock speed - 3.50 GHz. Maximum operating temperature - 85.0°C. Manufacturing process technology - 32 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 15360 KB (shared).

Supported memory types: DDR3 800/1066/1333/1600. Maximum memory size: 384 GB.

Supported socket types: FCLGA2011. Maximum number of processors in a configuration - 2. Power consumption (TDP): 130 Watt.

Benchmarks

PassMark
Single thread mark

Top 1 CPU

This CPU

4870

1566

PassMark
CPU mark

Top 1 CPU

This CPU

156834

12829

Geekbench 4
Single Core

Top 1 CPU

This CPU

5311

672

Geekbench 4
Multi-Core

Top 1 CPU

This CPU

36691

4039

Name	Value
PassMark - Single thread mark	1566
PassMark - CPU mark	12829
Geekbench 4 - Single Core	672
Geekbench 4 - Multi-Core	4039

Specifications (specs)

Essentials
Architecture codename	Sandy Bridge EP
Launch date	March 2012
Launch price (MSRP)	$714
Place in performance rating	1728
Price now	$226
Processor Number	E5-2667
Series	Intel® Xeon® Processor E5 Family
Status	Discontinued
Value for money (0-100)	13.51
Vertical segment	Server
Performance
64 bit support
Base frequency	2.90 GHz
Bus Speed	8 GT/s QPI
Die size	435 mm
L1 cache	64 KB (per core)
L2 cache	256 KB (per core)
L3 cache	15360 KB (shared)
Manufacturing process technology	32 nm
Maximum core temperature	85.0°C
Maximum frequency	3.50 GHz
Number of cores	6
Number of QPI Links	2
Number of threads	12
Transistor count	2270 million
VID voltage range	0.60V-1.35V

Memory
ECC memory support
Max memory channels	4
Maximum memory bandwidth	51.2 GB/s
Maximum memory size	384 GB
Supported memory types	DDR3 800/1066/1333/1600
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	2
Package Size	52.5mm x 45.0mm
Sockets supported	FCLGA2011
Thermal Design Power (TDP)	130 Watt
Peripherals
Max number of PCIe lanes	40
PCI Express revision	3.0
Scalability	2S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)