Intel Xeon W-2175 processor review
Xeon W-2175 processor released by Intel; release date: Q4'17. The processor is designed for server-computers and based on Skylake microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 14, threads - 28. Maximum CPU clock speed - 4.30 GHz. Manufacturing process technology - 14 nm.
Supported memory types: DDR4 1600/1866/2133/2400/2666. Maximum memory size: 512 GB.
Supported socket types: FCLGA2066. Maximum number of processors in a configuration - 1. Power consumption (TDP): 140 Watt.
Benchmarks
| PassMark Single thread mark |
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| PassMark CPU mark |
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| Name | Value |
|---|---|
| PassMark - Single thread mark | 2472 |
| PassMark - CPU mark | 23413 |
Specifications (specs)
Essentials |
|
| Architecture codename | Skylake |
| Launch date | Q4'17 |
| Place in performance rating | 780 |
| Processor Number | W-2175 |
| Series | Intel® Xeon® W Processor |
| Status | Launched |
| Vertical segment | Server |
Performance |
|
| 64 bit support | |
| Base frequency | 2.50 GHz |
| Bus Speed | 0 GT/s QPI |
| Manufacturing process technology | 14 nm |
| Maximum frequency | 4.30 GHz |
| Number of cores | 14 |
| Number of QPI Links | 0 |
| Number of threads | 28 |
| Number of Ultra Path Interconnect (UPI) Links | 0 |
Memory |
|
| Max memory channels | 4 |
| Maximum memory bandwidth | 85.3 GB/s |
| Maximum memory size | 512 GB |
| Supported memory types | DDR4 1600/1866/2133/2400/2666 |
Compatibility |
|
| Low Halogen Options Available | |
| Max number of CPUs in a configuration | 1 |
| Package Size | 45mm x 52.5mm |
| Sockets supported | FCLGA2066 |
| Thermal Design Power (TDP) | 140 Watt |
Peripherals |
|
| Max number of PCIe lanes | 48 |
| PCI Express revision | 3.0 |
| PCIe configurations | x4, x8, x16 |
| Scalability | 1S Only |
Security & Reliability |
|
| Execute Disable Bit (EDB) | |
| Intel® Identity Protection technology | |
| Intel® Memory Protection Extensions (Intel® MPX) | |
| Intel® OS Guard | |
| Intel® Secure Key technology | |
| Intel® Software Guard Extensions (Intel® SGX) | |
| Intel® Trusted Execution technology (TXT) | |
| Secure Boot | |
Advanced Technologies |
|
| Enhanced Intel SpeedStep® technology | |
| Idle States | |
| Instruction set extensions | Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512 |
| Intel 64 | |
| Intel® AES New Instructions | |
| Intel® Demand Based Switching | |
| Intel® Flex Memory Access | |
| Intel® Hyper-Threading technology | |
| Intel® Optane™ Memory Supported | |
| Intel® TSX-NI | |
| Intel® Turbo Boost technology | |
| Intel® Volume Management Device (VMD) | |
| Intel® vPro™ Platform Eligibility | |
| Number of AVX-512 FMA Units | 2 |
| Physical Address Extensions (PAE) | 46-bit |
| Speed Shift technology | |
| Thermal Monitoring | |
Virtualization |
|
| Intel® Virtualization Technology (VT-x) | |
| Intel® Virtualization Technology for Directed I/O (VT-d) | |
| Intel® VT-x with Extended Page Tables (EPT) | |
