AMD A4-3330MX vs Intel Core 2 Duo T6570

Comparative analysis of AMD A4-3330MX and Intel Core 2 Duo T6570 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Virtualization, Security & Reliability, Advanced Technologies. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

AMD A4-3330MX

Intel Core 2 Duo T6570

Differences

Reasons to consider the AMD A4-3330MX

CPU is newer: launch date 2 year(s) 11 month(s) later
Around 24% higher clock speed: 2.6 GHz vs 2.1 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
Around 8% better performance in PassMark - Single thread mark: 908 vs 843

Specifications (specs)
Launch date	8 December 2011 vs 1 January 2009
Maximum frequency	2.6 GHz vs 2.1 GHz
Manufacturing process technology	32 nm vs 45 nm
Benchmarks
PassMark - Single thread mark	908 vs 843

Reasons to consider the Intel Core 2 Duo T6570

Around 29% lower typical power consumption: 35 Watt vs 45 Watt

Specifications (specs)
Thermal Design Power (TDP)	35 Watt vs 45 Watt
Benchmarks
PassMark - CPU mark	758 vs 756
Geekbench 4 - Single Core	253 vs 252

Compare benchmarks

CPU 1: AMD A4-3330MX
CPU 2: Intel Core 2 Duo T6570

PassMark - Single thread mark

CPU 1

CPU 2

908

843

PassMark - CPU mark

CPU 1

CPU 2

756

758

Geekbench 4 - Single Core

CPU 1

CPU 2

252

253

Geekbench 4 - Multi-Core

CPU 1

CPU 2

449

Name	AMD A4-3330MX	Intel Core 2 Duo T6570
PassMark - Single thread mark	908	843
PassMark - CPU mark	756	758
Geekbench 4 - Single Core	252	253
Geekbench 4 - Multi-Core	449	449

Compare specifications (specs)

	AMD A4-3330MX	Intel Core 2 Duo T6570
Essentials
Architecture codename	Llano	Penryn
Launch date	8 December 2011	1 January 2009
Place in performance rating	2831	2900
Series	AMD A-Series	Intel Core 2 Duo
Vertical segment	Laptop	Laptop
Price now		$38.50
Value for money (0-100)		9.61
Performance
64 bit support
Die size	226 mm	107 mm
L1 cache	256 KB
L2 cache	2048 KB	2048 KB
Manufacturing process technology	32 nm	45 nm
Maximum frequency	2.6 GHz	2.1 GHz
Number of cores	2	2
Number of threads	2	2
Transistor count	1000 Million	410 Million
Front-side bus (FSB)		800 MHz
Memory
Supported memory types	DDR3
Compatibility
Max number of CPUs in a configuration	1
Sockets supported	FS1	PGA478
Thermal Design Power (TDP)	45 Watt	35 Watt
Virtualization
AMD Virtualization (AMD-V™)
Security & Reliability
Execute Disable Bit (EDB)
Advanced Technologies
Enhanced Intel SpeedStep® technology