AMD A4-5050 vs AMD Athlon Neo X2 L325

Comparative analysis of AMD A4-5050 and AMD Athlon Neo X2 L325 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD A4-5050

AMD Athlon Neo X2 L325

Differences

Reasons to consider the AMD A4-5050

CPU is newer: launch date 4 year(s) 4 month(s) later
2 more cores, run more applications at once: 4 vs 2
2 more threads: 4 vs 2
Around 3% higher clock speed: 1.55 GHz vs 1.5 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 28 nm vs 65 nm
2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 29% lower typical power consumption: 13.5 Watt vs 18 Watt
2.4x better performance in PassMark - CPU mark: 1328 vs 556

Specifications (specs)
Launch date	1 February 2014 vs 10 September 2009
Number of cores	4 vs 2
Number of threads	4 vs 2
Maximum frequency	1.55 GHz vs 1.5 GHz
Manufacturing process technology	28 nm vs 65 nm
L2 cache	2 MB vs 1024 KB
Thermal Design Power (TDP)	13.5 Watt vs 18 Watt
Benchmarks
PassMark - CPU mark	1328 vs 556

Reasons to consider the AMD Athlon Neo X2 L325

Around 5% better performance in PassMark - Single thread mark: 567 vs 538

Benchmarks
PassMark - Single thread mark	567 vs 538

Compare benchmarks

CPU 1: AMD A4-5050
CPU 2: AMD Athlon Neo X2 L325

PassMark - Single thread mark

CPU 1

CPU 2

538

567

PassMark - CPU mark

CPU 1

CPU 2

1328

556

Name	AMD A4-5050	AMD Athlon Neo X2 L325
PassMark - Single thread mark	538	567
PassMark - CPU mark	1328	556

Compare specifications (specs)

	AMD A4-5050	AMD Athlon Neo X2 L325
Essentials
Architecture codename	Kabini	Congo
Launch date	1 February 2014	10 September 2009
Place in performance rating	2873	2879
Series	AMD A-Series	2x AMD Athlon Neo
Vertical segment	Laptop	Laptop
Performance
64 bit support
Die size	246 mm
L1 cache	256 KB
L2 cache	2 MB	1024 KB
Manufacturing process technology	28 nm	65 nm
Maximum case temperature (TCase)	90 °C
Maximum frequency	1.55 GHz	1.5 GHz
Number of cores	4	2
Number of threads	4	2
Transistor count	1178 million
Front-side bus (FSB)		1600 MHz
Maximum core temperature		95 °C
Memory
Supported memory types	DDR3
Compatibility
Max number of CPUs in a configuration	1
Sockets supported	FT3	ASB1
Thermal Design Power (TDP)	13.5 Watt	18 Watt
Advanced Technologies
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
VirusProtect
Virtualization
AMD Virtualization (AMD-V™)