AMD A4-5050 vs Intel Core 2 Duo T5850

Comparative analysis of AMD A4-5050 and Intel Core 2 Duo T5850 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the AMD A4-5050

  • CPU is newer: launch date 5 year(s) 4 month(s) later
  • 2 more cores, run more applications at once: 4 vs 2
  • 2 more threads: 4 vs 2
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 28 nm vs 65 nm
  • 2.4x lower typical power consumption: 13.5 Watt vs 34 Watt
  • Around 93% better performance in PassMark - CPU mark: 1328 vs 687
Specifications (specs)
Launch date 1 February 2014 vs 1 October 2008
Number of cores 4 vs 2
Number of threads 4 vs 2
Manufacturing process technology 28 nm vs 65 nm
Thermal Design Power (TDP) 13.5 Watt vs 34 Watt
Benchmarks
PassMark - CPU mark 1328 vs 687

Reasons to consider the Intel Core 2 Duo T5850

  • Around 35% higher clock speed: 2.1 GHz vs 1.55 GHz
  • Around 46% better performance in PassMark - Single thread mark: 787 vs 538
Specifications (specs)
Maximum frequency 2.1 GHz vs 1.55 GHz
Benchmarks
PassMark - Single thread mark 787 vs 538

Compare benchmarks

CPU 1: AMD A4-5050
CPU 2: Intel Core 2 Duo T5850

PassMark - Single thread mark
CPU 1
CPU 2
538
787
PassMark - CPU mark
CPU 1
CPU 2
1328
687
Name AMD A4-5050 Intel Core 2 Duo T5850
PassMark - Single thread mark 538 787
PassMark - CPU mark 1328 687
Geekbench 4 - Single Core 241
Geekbench 4 - Multi-Core 430

Compare specifications (specs)

AMD A4-5050 Intel Core 2 Duo T5850

Essentials

Architecture codename Kabini Merom
Launch date 1 February 2014 1 October 2008
Place in performance rating 2888 2936
Series AMD A-Series Intel Core 2 Duo
Vertical segment Laptop Laptop
Price now $15.90
Value for money (0-100) 22.13

Performance

64 bit support
Die size 246 mm
L1 cache 256 KB
L2 cache 2 MB 2 MB
Manufacturing process technology 28 nm 65 nm
Maximum case temperature (TCase) 90 °C
Maximum frequency 1.55 GHz 2.1 GHz
Number of cores 4 2
Number of threads 4 2
Transistor count 1178 million
Front-side bus (FSB) 667 MHz

Memory

Supported memory types DDR3

Compatibility

Max number of CPUs in a configuration 1
Sockets supported FT3
Thermal Design Power (TDP) 13.5 Watt 34 Watt

Advanced Technologies

Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions

Virtualization

AMD Virtualization (AMD-V™)