AMD A6-6400B vs AMD Phenom II X3 740 BE
Comparative analysis of AMD A6-6400B and AMD Phenom II X3 740 BE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics API support, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD A6-6400B
- Around 37% higher clock speed: 4.1 GHz vs 3 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm SOI vs 45 nm
- Around 46% lower typical power consumption: 65 Watt vs 95 Watt
- Around 64% better performance in PassMark - Single thread mark: 1608 vs 982
- Around 13% better performance in PassMark - CPU mark: 1616 vs 1424
Specifications (specs) | |
Maximum frequency | 4.1 GHz vs 3 GHz |
Manufacturing process technology | 32 nm SOI vs 45 nm |
Thermal Design Power (TDP) | 65 Watt vs 95 Watt |
Benchmarks | |
PassMark - Single thread mark | 1608 vs 982 |
PassMark - CPU mark | 1616 vs 1424 |
Reasons to consider the AMD Phenom II X3 740 BE
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- 1 more cores, run more applications at once: 3 vs 2
- 4x more L1 cache, more data can be stored in the L1 cache for quick access later
- Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
Unlocked | Unlocked vs Locked |
Number of cores | 3 vs 2 |
L1 cache | 128 KB (per core) vs 96 KB |
L2 cache | 512 KB (per core) vs 1 MB |
Compare benchmarks
CPU 1: AMD A6-6400B
CPU 2: AMD Phenom II X3 740 BE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD A6-6400B | AMD Phenom II X3 740 BE |
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PassMark - Single thread mark | 1608 | 982 |
PassMark - CPU mark | 1616 | 1424 |
Geekbench 4 - Single Core | 1836 | |
Geekbench 4 - Multi-Core | 4510 |
Compare specifications (specs)
AMD A6-6400B | AMD Phenom II X3 740 BE | |
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Essentials |
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Family | AMD A-Series Processors | |
OPN Tray | AD640BOKA23HL | |
Place in performance rating | 1636 | 1642 |
Series | AMD Business Class - Dual-Core A6-Series APU for Desktops | |
Vertical segment | Desktop | Desktop |
Architecture codename | Heka | |
Launch date | September 2009 | |
Performance |
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Base frequency | 3.9 GHz | |
L1 cache | 96 KB | 128 KB (per core) |
L2 cache | 1 MB | 512 KB (per core) |
Manufacturing process technology | 32 nm SOI | 45 nm |
Maximum core temperature | 70°C | |
Maximum frequency | 4.1 GHz | 3 GHz |
Number of cores | 2 | 3 |
Number of threads | 2 | |
Unlocked | ||
64 bit support | ||
Die size | 258 mm | |
L3 cache | 6144 KB (shared) | |
Transistor count | 758 million | |
Memory |
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Max memory channels | 2 | |
Supported memory frequency | 1866 MHz | |
Supported memory types | DDR3 | |
Graphics |
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Enduro | ||
Graphics max frequency | 800 MHz | |
iGPU core count | 192 | |
Processor graphics | AMD Radeon HD 8470D | |
Switchable graphics | ||
Unified Video Decoder (UVD) | ||
Video Codec Engine (VCE) | ||
Graphics interfaces |
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DisplayPort | ||
HDMI | ||
Graphics API support |
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DirectX | 11 | |
Compatibility |
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Sockets supported | FM2 | AM3 |
Thermal Design Power (TDP) | 65 Watt | 95 Watt |
Max number of CPUs in a configuration | 1 | |
Advanced Technologies |
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AMD App Acceleration | ||
AMD Elite Experiences | ||
AMD HD3D technology | ||
Enhanced Virus Protection (EVP) | ||
Fused Multiply-Add 4 (FMA4) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
PowerGating | ||
PowerNow | ||
RAID | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
IOMMU 2.0 |