AMD EPYC 3451 vs Intel Xeon E7-8891 v3
Comparative analysis of AMD EPYC 3451 and Intel Xeon E7-8891 v3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD EPYC 3451
- 6 more cores, run more applications at once: 16 vs 10
- 12 more threads: 32 vs 20
- Around 33% higher maximum core temperature: 105°C vs 79°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
- Around 65% lower typical power consumption: 100 Watt vs 165 Watt
Number of cores | 16 vs 10 |
Number of threads | 32 vs 20 |
Maximum core temperature | 105°C vs 79°C |
Manufacturing process technology | 14 nm vs 22 nm |
Thermal Design Power (TDP) | 100 Watt vs 165 Watt |
Reasons to consider the Intel Xeon E7-8891 v3
- Around 17% higher clock speed: 3.50 GHz vs 3 GHz
- Around 1% better performance in PassMark - Single thread mark: 1715 vs 1700
- Around 11% better performance in PassMark - CPU mark: 21615 vs 19532
Specifications (specs) | |
Maximum frequency | 3.50 GHz vs 3 GHz |
Max number of CPUs in a configuration | 8 vs 1 |
Benchmarks | |
PassMark - Single thread mark | 1715 vs 1700 |
PassMark - CPU mark | 21615 vs 19532 |
Compare benchmarks
CPU 1: AMD EPYC 3451
CPU 2: Intel Xeon E7-8891 v3
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD EPYC 3451 | Intel Xeon E7-8891 v3 |
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PassMark - Single thread mark | 1700 | 1715 |
PassMark - CPU mark | 19532 | 21615 |
Compare specifications (specs)
AMD EPYC 3451 | Intel Xeon E7-8891 v3 | |
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Essentials |
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Architecture codename | Zen (Snowy Owl) | Haswell |
Launch date | 21 Feb 2018 | Q2'15 |
Place in performance rating | 1186 | 1140 |
Processor Number | E7-8891V3 | |
Series | Intel® Xeon® Processor E7 v3 Family | |
Status | Launched | |
Vertical segment | Server | |
Performance |
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Base frequency | 2.15 GHz | 2.80 GHz |
Die size | 2x 213 mm² | |
L1 cache | 96K (per core) | |
L2 cache | 512K (per core) | |
L3 cache | 32MB (shared) | |
Manufacturing process technology | 14 nm | 22 nm |
Maximum core temperature | 105°C | 79°C |
Maximum frequency | 3 GHz | 3.50 GHz |
Number of cores | 16 | 10 |
Number of threads | 32 | 20 |
Transistor count | 4,800 million | |
Unlocked | ||
64 bit support | ||
Bus Speed | 9.6 GT/s QPI | |
Number of QPI Links | 3 | |
Memory |
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ECC memory support | ||
Supported memory types | DDR4-2666 MHz, Dual-channel | DDR4-1333/1600/1866, DDR3-1066/1333/1600 |
Max memory channels | 4 | |
Maximum memory bandwidth | 85 GB/s | |
Maximum memory size | 1.5 TB | |
Compatibility |
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Configurable TDP | 80-100 W | |
Max number of CPUs in a configuration | 1 | 8 |
Sockets supported | AMD BGA SP4r2 | FCLGA2011 |
Thermal Design Power (TDP) | 100 Watt | 165 Watt |
Low Halogen Options Available | ||
Package Size | 52mm x 45mm | |
Peripherals |
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PCIe configurations | Gen 3, 64 Lanes, (CPU only) | x4, x8, x16 |
Max number of PCIe lanes | 32 | |
PCI Express revision | 3.0 | |
Scalability | S8S | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Instruction Replay Technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 46-bit | |
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |