AMD Ryzen 5 7535HS vs AMD Ryzen 7 PRO 6850U

Comparative analysis of AMD Ryzen 5 7535HS and AMD Ryzen 7 PRO 6850U processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Ryzen 5 7535HS

AMD Ryzen 7 PRO 6850U

Differences

Reasons to consider the AMD Ryzen 5 7535HS

CPU is newer: launch date 8 month(s) later

Launch date	4 Jan 2023 vs 19 Apr 2022

Reasons to consider the AMD Ryzen 7 PRO 6850U

2 more cores, run more applications at once: 8 vs 6
4 more threads: 16 vs 12
Around 3% higher clock speed: 4.7 GHz vs 4.55 GHz
Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
Around 33% more L2 cache; more data can be stored in the L2 cache for quick access later
1048576x more L3 cache, more data can be stored in the L3 cache for quick access later
2.3x lower typical power consumption: 15 Watt vs 35 Watt
Around 2% better performance in PassMark - Single thread mark: 3233 vs 3169
Around 13% better performance in PassMark - CPU mark: 20778 vs 18378

Specifications (specs)
Number of cores	8 vs 6
Number of threads	16 vs 12
Maximum frequency	4.7 GHz vs 4.55 GHz
L1 cache	512 KB vs 64K (per core)
L2 cache	4 MB vs 512K (per core)
L3 cache	16 MB vs 16MB (shared)
Thermal Design Power (TDP)	15 Watt vs 35 Watt
Benchmarks
PassMark - Single thread mark	3233 vs 3169
PassMark - CPU mark	20778 vs 18378

Compare benchmarks

CPU 1: AMD Ryzen 5 7535HS
CPU 2: AMD Ryzen 7 PRO 6850U

PassMark - Single thread mark

CPU 1

CPU 2

3169

3233

PassMark - CPU mark

CPU 1

CPU 2

18378

20778

Name	AMD Ryzen 5 7535HS	AMD Ryzen 7 PRO 6850U
PassMark - Single thread mark	3169	3233
PassMark - CPU mark	18378	20778

Compare specifications (specs)

	AMD Ryzen 5 7535HS	AMD Ryzen 7 PRO 6850U
Essentials
Architecture codename	Zen 3+ (Rembrandt)	Zen 3+
Launch date	4 Jan 2023	19 Apr 2022
Place in performance rating	517	462
Vertical segment		Mobile
Performance
Base frequency	3.3 GHz	2.7 GHz
Die size	208 mm²	208 mm²
L1 cache	64K (per core)	512 KB
L2 cache	512K (per core)	4 MB
L3 cache	16MB (shared)	16 MB
Manufacturing process technology	6 nm	6 nm
Maximum core temperature	95°C	95 °C
Maximum frequency	4.55 GHz	4.7 GHz
Number of cores	6	8
Number of threads	12	16
Unlocked
Memory
ECC memory support
Supported memory types	DDR5-4800 MHz, Dual-channel	DDR5-4800
Max memory channels		2
Compatibility
Configurable TDP	35-54 Watt	15-28 Watt
Max number of CPUs in a configuration	1	1
Sockets supported	FP7	FP7
Thermal Design Power (TDP)	35 Watt	15 Watt
Peripherals
PCIe configurations	Gen 4, 20 Lanes, (CPU only)
Max number of PCIe lanes		20
PCI Express revision		4.0
Graphics
Graphics max dynamic frequency		2200 MHz
Graphics interfaces
DisplayPort
HDMI