AMD Ryzen 7 7840HS vs Intel Xeon W-1350P
Comparative analysis of AMD Ryzen 7 7840HS and Intel Xeon W-1350P processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the AMD Ryzen 7 7840HS
- CPU is newer: launch date 1 year(s) 7 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 14 nm
- 3.6x lower typical power consumption: 35 Watt vs 125 Watt
- Around 8% better performance in PassMark - Single thread mark: 3769 vs 3489
- Around 47% better performance in PassMark - CPU mark: 28782 vs 19611
| Specifications (specs) | |
| Launch date | Jan 2023 vs 6 May 2021 |
| Manufacturing process technology | 4 nm vs 14 nm |
| Thermal Design Power (TDP) | 35 Watt vs 125 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 3769 vs 3489 |
| PassMark - CPU mark | 28782 vs 19611 |
Reasons to consider the Intel Xeon W-1350P
- 7.5x more L1 cache, more data can be stored in the L1 cache for quick access later
- 3145728x more L2 cache, more data can be stored in the L2 cache for quick access later
- 786432x more L3 cache, more data can be stored in the L3 cache for quick access later
| L1 cache | 480 KB vs 64K (per core) |
| L2 cache | 3 MB vs 1MB (per core) |
| L3 cache | 12 MB vs 16MB (shared) |
Compare benchmarks
CPU 1: AMD Ryzen 7 7840HS
CPU 2: Intel Xeon W-1350P
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | AMD Ryzen 7 7840HS | Intel Xeon W-1350P |
|---|---|---|
| PassMark - Single thread mark | 3769 | 3489 |
| PassMark - CPU mark | 28782 | 19611 |
| 3DMark Fire Strike - Physics Score | 7364 |
Compare specifications (specs)
| AMD Ryzen 7 7840HS | Intel Xeon W-1350P | |
|---|---|---|
Essentials |
||
| Architecture codename | Zen 4 | Rocket Lake |
| Launch date | Jan 2023 | 6 May 2021 |
| Place in performance rating | 377 | 369 |
| Launch price (MSRP) | $311 - $315 | |
| Processor Number | W-1350P | |
| Series | Intel Xeon W Processor | |
| Status | Launched | |
| Vertical segment | Workstation | |
Performance |
||
| Base frequency | 3.8 GHz | 4.00 GHz |
| Die size | 178 mm² | |
| L1 cache | 64K (per core) | 480 KB |
| L2 cache | 1MB (per core) | 3 MB |
| L3 cache | 16MB (shared) | 12 MB |
| Manufacturing process technology | 4 nm | 14 nm |
| Maximum core temperature | 100°C | 100°C |
| Maximum frequency | 5.1 GHz | 5.10 GHz |
| Number of cores | 8 | |
| Number of threads | 16 | |
| Unlocked | ||
| 64 bit support | ||
| Bus Speed | 8 GT/s | |
Memory |
||
| ECC memory support | ||
| Supported memory types | DDR5-5600 MHz, Dual-channel | DDR4-3200 |
| Max memory channels | 2 | |
| Maximum memory bandwidth | 50 GB/s | |
| Maximum memory size | 128 GB | |
Compatibility |
||
| Max number of CPUs in a configuration | 1 | 1 |
| Sockets supported | FP8 | FCLGA1200 |
| Thermal Design Power (TDP) | 35 Watt | 125 Watt |
| Configurable TDP-down | 95 Watt | |
| Configurable TDP-down Frequency | 3.00 GHz | |
| Package Size | 37.5 mm x 37.5 mm | |
| Thermal Solution | PCG 2019A | |
Peripherals |
||
| PCIe configurations | Gen 4, 20 Lanes, (CPU only) | Up to 1x16+1x4, 2x8+1x4, 1x8+3x4 |
| Max number of PCIe lanes | 20 | |
| PCI Express revision | 4.0 | |
| Scalability | 1S Only | |
Graphics |
||
| Device ID | 0x4C90 | |
| Execution Units | 32 | |
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 1.30 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 64 GB | |
| Processor graphics | Intel UHD Graphics P750 | |
Graphics interfaces |
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| Number of displays supported | 3 | |
Graphics image quality |
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| 4K resolution support | ||
| Max resolution over DisplayPort | 5120 x 3200 @60Hz | |
| Max resolution over eDP | 5120 x 3200 @60Hz | |
Graphics API support |
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| DirectX | 12.1 | |
| OpenGL | 4.5 | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2, Intel AVX-512 | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® Thermal Velocity Boost | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||