AMD Athlon 64 TF-20 vs AMD Mobile Sempron 3300+

Comparative analysis of AMD Athlon 64 TF-20 and AMD Mobile Sempron 3300+ processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the AMD Athlon 64 TF-20

  • CPU is newer: launch date 3 year(s) 10 month(s) later
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
  • 4x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 2.5x lower typical power consumption: 25 Watt vs 62 / 25 Watt
Launch date 1 May 2009 vs 1 June 2005
Manufacturing process technology 65 nm vs 90 nm
L2 cache 512 KB vs 128 KB
Thermal Design Power (TDP) 25 Watt vs 62 / 25 Watt

Reasons to consider the AMD Mobile Sempron 3300+

  • Around 25% higher clock speed: 2 GHz vs 1.6 GHz
  • Around 26% better performance in PassMark - Single thread mark: 574 vs 454
  • Around 68% better performance in PassMark - CPU mark: 445 vs 265
Specifications (specs)
Maximum frequency 2 GHz vs 1.6 GHz
Benchmarks
PassMark - Single thread mark 574 vs 454
PassMark - CPU mark 445 vs 265

Compare benchmarks

CPU 1: AMD Athlon 64 TF-20
CPU 2: AMD Mobile Sempron 3300+

PassMark - Single thread mark
CPU 1
CPU 2
454
574
PassMark - CPU mark
CPU 1
CPU 2
265
445
Name AMD Athlon 64 TF-20 AMD Mobile Sempron 3300+
PassMark - Single thread mark 454 574
PassMark - CPU mark 265 445
Geekbench 4 - Single Core 687
Geekbench 4 - Multi-Core 660

Compare specifications (specs)

AMD Athlon 64 TF-20 AMD Mobile Sempron 3300+

Essentials

Architecture codename Sherman Roma
Launch date 1 May 2009 1 June 2005
Place in performance rating 2866 2871
Series AMD Athlon 64 AMD Mobile Sempron
Vertical segment Laptop Laptop

Performance

64 bit support
Front-side bus (FSB) 667 MHz 800 MHz
L1 cache 64+64 KB
L2 cache 512 KB 128 KB
Manufacturing process technology 65 nm 90 nm
Maximum core temperature 95 °C
Maximum frequency 1.6 GHz 2 GHz
Number of cores 1 1
Number of threads 1 1

Compatibility

Sockets supported S1g1 745
Thermal Design Power (TDP) 25 Watt 62 / 25 Watt

Advanced Technologies

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