AMD Athlon II N350 vs Intel Pentium D 960

Comparative analysis of AMD Athlon II N350 and Intel Pentium D 960 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies, Virtualization, Memory, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Athlon II N350

  • CPU is newer: launch date 4 year(s) 5 month(s) later
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
  • 9.1x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 3.7x lower typical power consumption: 35 Watt vs 130 Watt
  • Around 26% better performance in PassMark - Single thread mark: 983 vs 782
  • Around 6% better performance in PassMark - CPU mark: 856 vs 807
Specifications (specs)
Launch date 4 October 2010 vs May 2006
Manufacturing process technology 45 nm vs 65 nm
L1 cache 256 KB vs 28 KB
Thermal Design Power (TDP) 35 Watt vs 130 Watt
Benchmarks
PassMark - Single thread mark 983 vs 782
PassMark - CPU mark 856 vs 807

Reasons to consider the Intel Pentium D 960

  • Around 50% higher clock speed: 3.6 GHz vs 2.4 GHz
  • 4x more L2 cache, more data can be stored in the L2 cache for quick access later
Maximum frequency 3.6 GHz vs 2.4 GHz
L2 cache 4096 KB vs 1024 KB

Compare benchmarks

CPU 1: AMD Athlon II N350
CPU 2: Intel Pentium D 960

PassMark - Single thread mark
CPU 1
CPU 2
983
782
PassMark - CPU mark
CPU 1
CPU 2
856
807
Name AMD Athlon II N350 Intel Pentium D 960
PassMark - Single thread mark 983 782
PassMark - CPU mark 856 807

Compare specifications (specs)

AMD Athlon II N350 Intel Pentium D 960

Essentials

Architecture codename Champlain Presler
Launch date 4 October 2010 May 2006
Place in performance rating 2318 2601
Series AMD Athlon II Legacy Intel® Pentium® Processor
Vertical segment Laptop Desktop
Processor Number 960
Status Discontinued

Performance

64 bit support
Die size 117.5 mm 162 mm2
Front-side bus (FSB) 3200 MHz
L1 cache 256 KB 28 KB
L2 cache 1024 KB 4096 KB
Manufacturing process technology 45 nm 65 nm
Maximum frequency 2.4 GHz 3.6 GHz
Number of cores 2 2
Number of threads 2
Transistor count 234 Million 376 million
Base frequency 3.60 GHz
Bus Speed 800 MHz FSB
Maximum core temperature C1=68.6°C, D0=63.4°C
VID voltage range 1.200V-1.3375V

Compatibility

Sockets supported S1 PLGA775
Thermal Design Power (TDP) 35 Watt 130 Watt
Low Halogen Options Available
Max number of CPUs in a configuration 2
Package Size 37.5mm x 37.5mm

Advanced Technologies

VirusProtect
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE) 32-bit
Thermal Monitoring

Virtualization

AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)

Memory

Supported memory types DDR1, DDR2, DDR3

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)