AMD Athlon Neo MV-40 vs Intel Mobile Pentium 4 3.06

Comparative analysis of AMD Athlon Neo MV-40 and Intel Mobile Pentium 4 3.06 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

AMD Athlon Neo MV-40

Intel Mobile Pentium 4 3.06

Differences

Reasons to consider the AMD Athlon Neo MV-40

CPU is newer: launch date 5 year(s) 7 month(s) later
A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 130 nm
16x more L1 cache, more data can be stored in the L1 cache for quick access later
4.7x lower typical power consumption: 15 Watt vs 70 Watt

Launch date	6 January 2009 vs June 2003
Manufacturing process technology	65 nm vs 130 nm
L1 cache	128 KB vs 8 KB
Thermal Design Power (TDP)	15 Watt vs 70 Watt

Reasons to consider the Intel Mobile Pentium 4 3.06

Around 92% higher clock speed: 3.07 GHz vs 1.6 GHz
Around 35% better performance in PassMark - Single thread mark: 657 vs 485
Around 26% better performance in PassMark - CPU mark: 347 vs 275

Specifications (specs)
Maximum frequency	3.07 GHz vs 1.6 GHz
Benchmarks
PassMark - Single thread mark	657 vs 485
PassMark - CPU mark	347 vs 275

Compare benchmarks

CPU 1: AMD Athlon Neo MV-40
CPU 2: Intel Mobile Pentium 4 3.06

PassMark - Single thread mark

CPU 1

CPU 2

485

657

PassMark - CPU mark

CPU 1

CPU 2

275

347

Name	AMD Athlon Neo MV-40	Intel Mobile Pentium 4 3.06
PassMark - Single thread mark	485	657
PassMark - CPU mark	275	347
Geekbench 4 - Single Core	777
Geekbench 4 - Multi-Core	719

Compare specifications (specs)

	AMD Athlon Neo MV-40	Intel Mobile Pentium 4 3.06
Essentials
Architecture codename	Huron	Northwood
Launch date	6 January 2009	June 2003
Place in performance rating	2793	2772
Series	AMD Athlon Neo
Vertical segment	Laptop	Laptop
Performance
64 bit support
Front-side bus (FSB)	1600 MHz
L1 cache	128 KB	8 KB
L2 cache	512 KB	512 KB
Manufacturing process technology	65 nm	130 nm
Maximum core temperature	95 °C
Maximum frequency	1.6 GHz	3.07 GHz
Number of cores	1	1
Number of threads	1
Die size		131 mm
Maximum case temperature (TCase)		74 °C
Transistor count		55 million
Compatibility
Sockets supported	ASB1	478
Thermal Design Power (TDP)	15 Watt	70 Watt
Max number of CPUs in a configuration		1
Advanced Technologies
VirusProtect
Intel® Hyper-Threading technology
Virtualization
AMD Virtualization (AMD-V™)
Memory
Supported memory types		DDR1, DDR2